Scott Kao Email & Phone Number

台灣 Taiwan 新竹市

Unikorn Semiconductor Co., Ltd., Hsinchu, 2022－2024Senior Process Integration EngineerAs a process integration engineer for VCSEL products, I was responsible for several yield improvement projects, including:1. Aperture Peeling Defect:Addressed customer complaints and product scrap issues caused by aperture peeling defects. I conducted engineering verification of the product's thermal effects and optimized the thermal process conditions, resulting in a 2.2% yield improvement.2. Ith Electrical Out-of-Spec Issue:Investigated customer complaints related to Ith electrical out-of-spec conditions impacting yield. After analyzing the electrical data and relevant process information of defective products, I discovered that the issue was due to uneven uniformity in the coating machine(PECVD), which had reached its operational limits. I conducted engineering verification of the coating process specifications and re-targeted the coating thickness, improving the product yield by 2.5%.Reason for Leaving:Due to operational losses, the company underwent organizational downsizing and personnel reductions.

Hsinchu

Macronix International Co., Ltd., Hsinchu, 2010－2022Diffusion Process Engineer (staff engineer 2010; chief engineer 2016)Furnace group (2010-2016):1. Flash SION, SN-F process WPH improved 10% and 8% respectively by reducing step time (2011).2. Flash SION+SN-F combined process WPH improved 25% (2012).3. Flash ONO process batch size extend (capacity improved 66%), Cpk improved (Cpk 1.7 to 3.29) and reduced deviation for thickness, uniformity and WAT related item (2014-2015).4. Flash ONO Cpk improved(<1.67 to 2.2) by modifying reclaim monitor wafer clean procedure and setting 48hrs monitor wafer utility Q-time (2016).5. Foundry CV short loop to monitor AP furnace oxide film quality (2016).6. Furnace sponsor of SVG, TEL alpha-8SE, TEL-8S, THM (UV1280), Quantox.Wet clean group (2016-2018):1. Reduced PNR wet etch tools’ PM1 48% (improve AT, reduce TA loading, chemicals usage rate 100%) through the use of innovative chemicals control system (2017).2. MARK PM1 with photograph develop to define mark site to prevent lost effective die (2018).3. Wet clean sponsor of SNR, CLF, WBH, CRM, CLS, PNR (DV24), MARK.Implanter group (2018-2022):1. Flash, logic abnormal analysis and prevention for IHC inline defect issue and IHE inline WAT fail event.2. Implanter sponsor of IHC (VIISION, VIISTA), IMC (VARIAN E500), IHE (AXCELIS VHE), thermal wave.

Zhubei City, Taiwan, Taiwan

Tsing-Hua Technology Co., Ltd., Hsinchu, 2007－2010Senior Environmental Engineer1. Analytical chemist at an environmental analysis laboratory which analyzed composition of environmental pollutants and chemical materials.2. Prepped and analyzed air, water, waste, and soil samples by; EPA GC-MS VOC methods NIEA A715, and NIEA W785; EPA GC-MS SVOC methods NIEA M731, and NIEA R814.3. Write and updated Standard Operating Procedures (SOPs).4. Help cross train and train new analyst on GC/GC-MS methods and sample prep.5. Acquired certification bonus of EPA methods to perform methods NIEA A715, NIEA A722, and NIEA W785.

碩士, Biochemistry, Grade Point : 3.3

Activities and Societies: Master’s thesis: “(1) Simultaneous Analysis of 3,N4-Ethenocytosine and 1,N6-Ethenoadenine in Human Urine.

學士, 應用化學係, Grade Point : 4

Activities and Societies: 1. Acquired the “University tuition scholarship” of providence university, 2003 2. Volunteer of providence.