• Spearhead R&D initiatives in lithography and patterning processes, achieving stringent customer specifications for dimension and uniformity.• Design photomasks for layer-to-layer alignment, contributing to the successful development of products with critical chip dimensions of 2.8x2.8mm.• Innovate with new photoresists to attain a feature size of 25µm with a CpK of 2.2, ensuring zero dimensional rejects across full substrates. And further pushed the boundaries to achieve less than 10um structuring on glass substrates.• Implement new resist cleaning and lift-off processes, guaranteeing 100% resist removal without compromising chip integrity.• Pioneer a novel cleaning process for non-lithography products, optimizing tooling design for ultrasonic cleaning efficiency.

Startup of new LED wafer fabrication plant.Work with cross functional team for technology transfer, equipment purchase, floor-layout planning, facilities setup, machine setup and qualifying wafers.Main process and equipment are metal lift-off, high pressure jet resist cleaning, high pressure jet particles cleaning, batch-spray resist cleaning, wet bench etching, titrator and chemical mixing station.

Job scope is sustaining and improving hard-disk drive slider process cleanlinesslevel post CMP/lapping. Responsibilities also include machine maintenance andtroubleshooting.Experience translated to skills are ▪ SPC data setup and monitoring by utilizing Time to Trigger and False Alarm Rate▪ Process improvement through Regression correlation, DOE▪ Leading capital avoidance and capacity improvement projects by converting machine to run different process such as from solvent to aqueous, robot arm optimization▪ Material characterization by using FTIR, FIB, SEM/EDX and TOF-SIM, Surface profiler▪ New material selection for ESD safe, corrosion prevention, chemical resistance process environment▪ Design machine tooling based on Solidwork Simulation by collaborating with vendor.▪ SQL query and Minitab data analysis.