Sebastian Schindler Email & Phone Number

Halle, Germany

Research project application for PV module technology topics (module assembly, cell stringing, inline diagnostics, etc.)Industry project supervision, enhancement equipment facilities, etc.Project initiation and acquisition within Fraunhofer institutes, EU research fundings and international consortia

Halle, Germany

Scientific staff w/i group 'Module Technology'Research project management on solar cell interconnection technologies (bonding, adhesive bonding, soldering...)Qualification lead-free vs. lead-containing soldersMicrostructural diagnostics and investigations on contact Formation and microstructural properties of solar cell solder joints development of module.

Halle, Germany

Administration of ground and installation works, lay out design of laboratory infrastructure, management of equipment purchases / call for bids, personnel engagements

Process development for fine-pitch copper wire bonding processexperimental series and DoE'sprocess characterization, equipement evaluationanalysis and assessment of materials, tools, and prototypesanalysis and documentation of experiments and realibility investigations

Dresden

scientific staff w/i research group 'wire bonding technologies'process evaluation for microelectronic wire bond processesmicrostructure diagnostics and deformation evaluation of wire bondsreliability investigations on wire bond interconnectionsresearch project on copper wire bond process for fine pitch applicationsresearch project on gold wire bonding on.

Dresden

Printing process evaluation for wafer level packages, experimental series, analysis and documentation

Dresden

Printing process evaluation for wafer level packages, experimental series, analysis and documentation

Dresden

working 'biocompatible packaging and interconnection technologies' at the Electronics Packaging Laboratorycomponent and assembly analysis for biocompatibility,material investigations with cell cultures, experimental series, analysis and documentation

Berlin

component and assembly qualification, DoE, analysis and assessment of experiments, designs and prototypes, experimental state to batch production

Diploma Dipl.-Ing., Electrical And Electronics Engineering

Diploma thesis, topic: Characterization and optimization of coated bonding wires for ultrasonic wire bonding processes

Main Studies, Electrical And Electronics Engineering

Main studies w/ specialization in 'electronics packaging and interconnection technologies', plus w/i 'biocompatibility' and 'medical.

Basic Studies, Electrical And Electronics Engineering