2.5 years’ worth of experience working in semiconductor industry wire bond department. Equipped with adequate wire bond process knowledge, process management skill, acknowledged as package owner for 1 of the major customer devices. Experience in troubleshooting for wire bond machine, excursion cases and provide root cause analysis with corrective/preventive action.

2.5 months of enrollment as to explore and learn and experience obligation and job scope of an wire bond process engineer. Exposed with basic skills and hands on technique in wire bond machine.