Feng Dai

Feng Dai Email and Phone Number

Foundry Technology Director at Rambus
Feng Dai's Location
San Jose, California, United States, United States
Feng Dai's Contact Details

Feng Dai personal email

Feng Dai phone numbers

About Feng Dai

Feng Dai is a Foundry Technology Director at Rambus. Colleagues describe him as "When working at Cypress semiconductor, Feng was a good leader and demonstrated strong technical excellence. He led projects across multiple technology nodes. The success of the projects highly relied on his capability of good communication, strong technical problem solving and attention to the details. He was a good leader and could motivate the team members to deliver under multiple dimension of pressure in the fast pace. It was a pleasure to work with Feng in leading edge technology development. I strongly believe in his potential in new positions."

Feng Dai's Current Company Details

Foundry Technology Director at Rambus
Feng Dai Work Experience Details
  • Rambus
    Foundry Technology Director
    Rambus Aug 2024 - Oct 2024
    San Jose, Ca, Us
  • Global Unichip (Guc) North America
    Deputy Director, Sales
    Global Unichip (Guc) North America Dec 2016 - Aug 2024
    Hsinchu Science Park, Tw
    ASIC sales providing turn-key service including IP, design, wafer fabrication (TSMC), packaging and testing (OSATs) with focus on advanced technology nodes 3/5/7/12nm, etc. Worked with top tier cloud service providers and won 5nm & 3nm CoWoS/HBM data center production projects as well as SOW engineering project.
  • Globalfoundries
    Director, Field Application Engineering
    Globalfoundries Dec 2009 - Dec 2016
    Malta, Ny, Us
    Wafer/PDK/IP related technical support to customers across all technology nodes (up to 14nm).
  • Chartered Semiconductor
    Senior Field Engineering Manager
    Chartered Semiconductor Mar 2007 - Dec 2009
    Us
    Wafer/PDK/IP related technical support to customers across all technology nodes (up to 40nm)
  • Cypress Semiconductor
    Technology R&D Manager
    Cypress Semiconductor Mar 2001 - Mar 2007
    San Jose, Ca, Us
    Technology development/production transfer for 0.13um, 90nm, 65nm, 45nm technologies. Process integration. SRAM bitcell design. Technology design rule definition. DFM, OPC, tapeout sign-off.
  • Chartered Semiconductor
    Technology R&D Senior Device Engineer
    Chartered Semiconductor May 1997 - Mar 2001
    Us
    Technology transfer of 0.35um & 0.25um embedded DRAM technology from Toshiba. Device development of 0.22um CMOS logic technology focusing on Idsat/Vt/Ioff/HCI, etc.

Feng Dai Skills

Semiconductor Industry Semiconductors Ic Soc Asic Cmos Silicon Eda Analog Design Of Experiments Spc Integrated Circuits Mixed Signal Thin Films Process Integration Failure Analysis Statistical Process Control

Feng Dai Education Details

  • National University Of Singapore
    National University Of Singapore
    Electrical Engineering
  • Shanghai Jiao Tong University
    Shanghai Jiao Tong University
    Optics
  • Shanghai Jiao Tong University
    Shanghai Jiao Tong University
    Applied Physics

Frequently Asked Questions about Feng Dai

What is Feng Dai's role at the current company?

Feng Dai's current role is Foundry Technology Director at Rambus.

What is Feng Dai's email address?

Feng Dai's email address is fe****@****hoo.com

What is Feng Dai's direct phone number?

Feng Dai's direct phone number is (408) 462*****

What schools did Feng Dai attend?

Feng Dai attended National University Of Singapore, Shanghai Jiao Tong University, Shanghai Jiao Tong University.

What skills is Feng Dai known for?

Feng Dai has skills like Semiconductor Industry, Semiconductors, Ic, Soc, Asic, Cmos, Silicon, Eda, Analog, Design Of Experiments, Spc, Integrated Circuits.

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