• Extensive experience in assembly and manufacturing processes including: wire bonding, flip chip, eutectic & epoxy bonding, encapsulation, bumping, micro dispensing (manual + automated), BGA attach, PCBA assembly, laser engraving, and active/passive optical alignment.• Manage a diverse portfolio of flip chip projects, systematically categorizing each project by under bump metallization, bump technology, material characterization, and package metrology to determine the ideal process flow for new product introductions.• Qualify new products during pilot stage and optimize process parameters for high-volume production.• Experience in practicing and implementing root cause failure analysis, risk management, and adherence to reliability standards including MIL-STD-883 and JEDEC.• Conduct and interpret both destructive and non-destructive package failure analysis using methods such as CSAM, X-Ray, metrology, shear test, wire pull, and package cross sections.• Experience in generating 3-D models, component drawings, and assembly drawings for fixtures and tools tailored to package assembly applications.• Collaborate on package design evaluations to assess the manufacturability of new products.• Conduct design of experiments to identify the optimal process flows for package assembly projects, leading to an increase in yield, performance, and improved cycle time.• Establish and enforce quality standards for package assembly projects, ensuring the integrity of outgoing inspections.• Develop reflow processes for a diverse range of materials and applications to meet > 95% yield rate.• Proficient in advanced packaging techniques: wafer level packaging, 2.5D and 3D packaging technologies.