BETELCO (Dhaka, Bangladesh) is one of the leading manufacturers of three phase distribution transformers, LV/HV switchgear and PFI plants in Bangladesh; it also provides a turnkey power solution involving engineering design of a turnkey system and it's supply, installation and commissioning, supply and installation of bus bar trunking systems and diesel generators. My responsibilities include product development, manufacturing process development and managing a team of design, operations and project engineers. In addition, I am also involved in collaborative research efforts with local R&D entities and universities.

Western Digital Corp. (California, USA and Bangkok, Thailand) laser bonding technology development for Energy Assisted Magnetic Recording (EAMR). My responsibilities include managing a team of engineers, technicians and operators for precision (+/- 0.5um) flip-chip bonding of lasers to hard-drive slider heads to support the development goals of the next generation high aerial density magnetic storage devices; layout design and specification of components (GaAs FP lasers, heat-sinks); working closely with vendor engineering teams (based in Asia, Europe and USA) to define process technology, inspect and qualify their products; eutectic solder stack development to meet low cost, low temperature and high creep resistance needs; supporting internal test (LIV, far field, mechanical strengths) and slider fabrication teams.

I worked on design and fabrication of InP and Ge based APD arrays, integrated micro-lens arrays, AlN submounts and high density photonics packaging solutions. My responsibilities included project management and technical directing and leadership, interaction with collaborative partners, various US national nanofabrication facilities, grant proposal review for government solicitations.

I worked on low-noise, high-gain InP based Linear and Geiger Mode APDs and arrays for photon counting and wavefrontsensing and imaging applications for defense and bio-medical products. My responsibilities included devicesimulation, epi-design, process development, program management, interaction with collaboration partners and potentialcustomers, grant proposal submissions and receiver business development for range finders

I worked on various types of wafer bonding including Si, GaAs, InP, GaN, SiC; epitaxial layer design anddevice fabrication for high power lasers for bio-medical applications; YAG crystal bonding; CVD diamond for heat sinking

Jan. '99-Mar '00 (reported to CTO):* Developed of low threshold oxide confined 850nm VCSELs for datacoms.* Chemical-mechanical polishing (CMP) of rough GaAs for wafer bonding to Si.* Developed of "Metal Plasma LEDs" - patent received* Process development, proto-typing, packaging of high brightness red and blue LEDs on AlInGaP and GaN.Mar. '00 - Oct. '00 - Cleanroom Construction (reported to the COO):* Managed construction (app. Value: US$ 3.5M) and Processing equipment procurement includingselection and testing prior to purchase (app. Value: US$ 2M);May '00 - Dec.'00 – Photonic Integrated Circuit Surface Emitting Laser (PICSEL) R&D, Testing (reported to CTO):* Automated cleaving, packaging, testing, and on-wafer screeningSept.'00 - Mar '01 - Set up Test Laboratory (reported to COO & CTO):* Selection and purchase of DC and high speed equipment (app. Value: US$1.5M)Apr '01 - Jan '03 - Manufacturing DC Test System Development (reported to VP of Engineering):* Developed high throughput DC (CW, pulsed LIV, spectrum, beam profile etc.,) screening station and test methodologies for high volume screening (app. Value:US$ 0.25M).Mar'01 - Jan‘03 - Life Test & Reliability System Development (reported to VP of Engineering):* Developed unique laser and APD life test systems for in-situ and automatic monitoring of device parameters for 1000+ hrs (app. Value: US$ 0.35M).* Set up in-house Telcordia (GR468) Standard test capability (85/85, temp cycling, life test, mechanical andESD tests) and wrote formal customer reliability reports.Mar'01 -Jan‘03 - Internal Consulting:* Designed the process control monitor cell to troubleshoot parasitic resistance and leakage current issues in design and manufacturing.* Played a key role in understanding and resolving isolation issues and photo current saturation problems* Characterized and solved thermal impedance issues