Enjoy working in a position that draws on my hands-on industrial and research experiences in the fields of fabrication, test andreliability of semiconductor devices and gives me the opportunity to engage in further professional development while meetingcorporate objectives. I like working on difficult technical challenges, have a strong work ethic, and enjoy problem solvingwhether working independently or as a member of a team* Ph.D. in semiconductor materials and device electronics, device modeling, fabrication and process development.* 14 years’ “hands-on” industrial work experience in US (InP, GaAs, GaN, SiC, Si, Ge wafer bonding, APD based sensors,high brightness LEDs, 1.3um FP, VCSEL and DFB telecom lasers, 808nm to 1.9um high power semi conductor laser diodes);* Three patents (lasers, wafer-bonding).Over 20 technical publications in peer reviewed international journals and conferences; * Extensive experience in electrical/optical testing of telecom and high power lasers, PINs, APDs, HPTs, HEMTs, LEDs, aswell as physics based modeling and data management.* 2 years’ R&D work experience in UK (high temperature HBTs for DERA).* Designed & managed facilities for Telcordia 468 reliability testing of lasers and APDs; wrote periodic reports for customers.* Project team management experience – engineering, processing and testing (SPC, FMEA); customer management skillsSpecialties: IR Detector design, modeling and fabrication; Integrated Micro Lens Arrays; III-V Compound Semiconductor Devices, Si and Ge devices; Wafer Bonding; Telecom and High Power Diode Lasers
Listed skills include Semiconductors, R&D, Sensors, Engineering, and 9 others.