• Was selected to lead company’s wire bonding flag project.• Project’s successful compilation was sighted by management as a key driver for regaining market leadership.• Led multi-national team of 25 Engineers in development of next generation Copper Wire Bonding technologies and processes for automatic wire bonding systems, resulting in gained market share and K&S becoming the copper wire bonding market leader.• Managed collaboration with leading semiconductor assembly customers in USA, Europe and Asia that enabling solutions for Copper wire bonding on sensitive devices.• Developed new technologies and processes using state-of-the-art TOYOTA Lean “A3 Thinking” and Agile development process ” later adopted as best known method in the company.

• Led multi-national, multi-disciplinary team of 15 Engineers through the development of next generation Wire Bonding capillaries and wires.• Product won the “2007 Advanced Packaging Award”.• Product became industry standard from 2007.• Managed product’s IP related issues and liaison with legal department.

Manufacturing Technologies Development (MTD) Manager.• Managed multi-disciplinary 9 employees team enabling future products manufacturing while reducing cost and improving yield and productivity • During the period production yield improved by 10%.• Led development of state of the art technologies to achieve world class yield and productivity. • Achieved break through in high precision grinding machines, servo powder press, measuring equipment, packaging devices and production floor automation.