We design, build, and service heavy duty equipment to automate packaging lines. I get to work with an amazing team, passionate about our customers. We are fast moving, agile, and have some of the deepest experience in the industry to solve our customers' problems - improving line productivity, scaling higher throughput and volume, lowering costs, and improving employee efficiency and engagement.Regardless of container - aluminum, steel, glass, plastic, or other.... - or container filling/decorating technology - we are here to serve, support, and deliver customer growth and success.

Recruited by private equity owners to reinvigorate global operations, product development, and accelerate revenue and EBITDA growth. Spectralink is a Private Equity owned global leader in purpose-built wireless communications. We empower mobile workers everyday with intelligent, Wi-Fi and DECT solutions that enable them to work smarter, not harder. Responsible to oversee all global business operations and provide strategic direction to all functional areas as effective COO leading P&L improvement, cash flow improvement, cultural transformation, and all operational functions including supply chain planning, manufacturing, procurement, repair, customer service, order to cash, procure to pay,delivery, quality, IT, and Global Real Estate,Led the fastest growing, most profitable business unit P&L, growing >50% annually, with a major fortune 100 customer. Led product launch and scaling of most successful products in company's history, achieving >70% win rate against competition.

Recruited by founder to lead global businness operations at Mini-Circuits a global leader in RF, IF, and microwave signal processing products. Built innovative new approaches to developing new products, simplifying overall supply chain and business operations, in a company with over 10,000 active products, 20,000 active customers, and manufacturing plants around the world. Leadership span included a global team spanning manufacturing, procurement, material planning, production control, logistics, and trade compliance, margin, and inventory/cash flow/liquidity management.Achieved 25%+ growth rate in revenue and margin in 3 consecutive years.

Led overall operations process re-engineering and transformation for end to end performance improvement. Includes $100M+ inventory reduction, 50% improvement in cycle time, and significantly lower costs - driven by implementation of advanced supply chain analytics, supplier collaboration, and change management across the operations team.Led successful merger integration of two large corporate supply chain teams (including purchasing, manufacturing, logistics, engineering, and quality), with very diverse cultures, processes, and tools. Overall M&A leader to creating new integrated organization of 7000+ manufacturing, engineering, and procurement professionals, with responsibility for over $10B spend, 30 manufacturing sites, and 50+ warehouse and distribution centers. Generated over $300M in bottom line impact through supply chain synergy.Reduced time to market by over 50% and increased margins by over 30% across broad product portfolio through agile development processes, and high performance integrated team approach.Transformed global manufacturing reducing costs by $1B a year via both leveraging contract manufacturing and leading M&A divestitures.Key leader establishing Lucent's Wireless Product Realization Center, including developing new wireless technology products, scaling new designs to volume, recruiting and developing 500+ technicians and engineers, and ramping up production. Led metamorphosis of "empty warehouse" into a high volume design and manufacturing facility in under six months, delivering 50% reduction in time to market. New products generated $1B in first year.Recruited by corporate venture capital fund to launch a wireless smart card business. Grew business from $0 to $15M in <3 years and successful exited venture with licensing deal with Denso.Began career as manufacturing and automation engineer. Designing and building clean room robotic systems, and building two new greenfield semiconductor wafer fabrication plants.