• Prepare materials and operate automated die attach (epoxy dispense/ cure), wire ball bonder, manual wedge bond and gap weld • Maintain cleanliness of materials and workstation before and after process • Support prototype and production manufacturing assembly • Support assembly rework and total quality goals • Perform in-line inspection with microscope • Comply with procedures outlined in traveler documentation

• Package LEDs to substrates (die attach, reflow, wire bond, singulation, fluid dispensing, phosphor dispensing, performance measurements) • Inspect at each phase of the manufacturing process utilizing high-powered microscopes • Work with engineers in the development of new assembly processes or packages • Maintain consumable materials inventory • Follow standard operating procedures, learn new processes and new developmental work • Operate automatic and manual lab equipment • Conduct basic troubleshooting and failure analysis of packages. Provide quick feedback to teams regarding failure mode and issues with materials • Communicate effectively with engineers and technicians to ensure that targets are clear across the organization • Characterization of LED chip packages through semi-automated systems (Source meter, spectrometer, integrating sphere, temperature controller)

• Process production and R&D semiconductors using automated machine. • Perform backend processing of LED wafers (ALSI- laser cutter, Tool Name- Singulation Breaker) • Perform inspection and measurement on outgoing wafers • Quality Inspection of LED wafers with high-powered microscopes and Automated Inspection tooling • Equipment setup in accordance with Standard Operating Procedures and Time Compliance Orders. • Handle wafers and die with tweezers and hand tools- great hand dexterity • Able to operate tools and fab area independently • Work with team members on tasks/priorities to satisfactorily complete assignments based on verbal/written instructions from Engineers • Use different types of chemicals such as Hydrochloric acid HCL, Gallium Phosphide Etchant GAP etch, Potassium Hydroxide KOH