I work in the Contamination-Free Manufacturing/Yield Defect Density Group within the Integration and Yield Department at a 300 mm FAB.Understanding advanced semiconductor manufacturing process flows, conducted real-time defect analysis, and managed lot dispositions across various technologies(Bulk CMOS,BCD,NVM,RFSOI,FDSOI,SiGe,MRAM) and technology nodes ranging from 28 nm to 130 nm.Conducted comprehensive investigations on tool/part commonality, wafer notch alignment, and tool arm dimensions to identify root causes and understand major excursions in the fab.Evaluate leading-edge E-beam, Bright field, and Dark field defect inspection tools, as well as SEM review tools, for introducing advanced technologies.Supported failure analysis to boost reliability by identifying and resolving random defects across various products and technologies.Maintain Statistical Process Control (SPC) charts for in-line defect control, Experienced in iMRB, PCRB disposition, FMEA, 8D.Actively monitoring reliability defects, executing a contamination control strategy, and performing an in-depth FMEA on defects in collaboration with module teams by analysing critical process flow elements to identify and mitigate potential risks.Review baseline defect control limits from PCRB and Cp/Cpk reports. Proficient in DOE and corner lot execution methodologies.Developed and implemented a process improvement plan using inline, ET, and yield data to meet quality and yield targets.

I worked as a Failure Analysis Engineer in the Yield Enhancement Department at a high-volume AMOLED Display ATMP Fab.Experienced with failure analysis techniques such as FTIR, X-ray, Optical Microscopy, SEM (Scanning Electron Microscopy)-EDS (Energy Dispersive X-Ray Spectroscopy), Cross-Sectional Analysis, Dual-beam FIB (Plasma Focused Ion Beam).Experienced in identifying defects and failure mechanisms through physical failure analysis using various layer-by-layer inspections (de-processing methods).Applied 8D, RCCA, and DOE methodologies, using Excel and Minitab for statistical analysis, and led immediate containment actions to minimize production impact.Prepared samples for Characterization. Measure film properties, organize data/reports for review and interpret data.Worked with cross-functional teams, performed product qualifications and collaborated with the manufacturing plant for Display assembly and test technology verification.Planned and executed resource management, designed experiments(DOE) with variable assembly techniques and reliability tests, conducted detailed analyses, and thoroughly documented results.Analyse root causes based on key materials, substrates, equipment, and processes to drive improvements and prevent issues from recurring.