Sid Deshpande Email and Phone Number
Sid Deshpande work email
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Sid Deshpande personal email
I am an electrical engineer with a passion for designing high speed and power circuits for electronic products, consumer goods, electric vehicles, and test equipment. With 6 years of experience in the field, I have a strong foundation in electrical engineering principles and a track record of successfully leading hardware projects from concept to production. I am excited to bring my expertise and experience to a company that is committed to driving innovation in the industry. As a probe card micro chip designer, I work with the latest technology in the semiconductor industry to build cutting edge tech for the future.
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Principal Electrical Design EngineerFormfactor Inc. Apr 2023 - PresentLivermore, Ca, Us• Designing microchips on Logic Probe Card Substrate (Organic and Ceramic) designs, including creating netlists, planning BGA floor layouts, and arranging 46-72 layer stack-up planning. • Reviewing physical layouts using Cadence Allegro.• Working on process development for Vertical Probe Cards technology• Driving design automation to fully automate the Substrate logical design process, helping improve design quality and efficiency.• Supporting major customers in the semiconductor industry for the probe card projects for their developing technology.
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Senior Hardware EngineerGenerac Power Systems Feb 2022 - Mar 2023Waukesha, Wi, Us• Responsible for development of microinverter hardware which includes design upgrades, schematics and layout improvements on Altium along with testing and calibration of the units/features, also in charge of interfacing with contract manufacturers (CMs) in east Asia regarding engineering changes(ECOs), component selection and process improvements. • Incharge or updates to engineering documents like Bill of Materials (BOM), design specification and validation plans.• Product management duties encompass supply chain management, electro-mechanical components sourcing, vendor relations and working with compliance standards for product improvements. • Lab work includes soldering and testing alternate components, capturing waveforms on oscilloscope and RMA analysis.• Other management tasks include collaborating with mechanical, firmware and layout teams to cross functionally develop the schedule for different prototypes and versions of the product. -
Hardware EngineerCanoga Perkins Jun 2020 - Feb 2022Chatsworth, California, Us• Collaborated with electrical designers and FPGA engineers to design high-speed circuits for new products.• Created and maintained electrical schematics and BOMs using Altium, and worked with the layout contractor and manufacturing team to design and fabricate PCBs.• Coordinated with Document Control, Purchasing, and the Stockroom, and provided weekly reports to upper management.• Tested prototypes in the design lab by programming ICs, debugging circuits, and performing minor soldering tasks.• Assisted with external testing lab interactions and completed python scripting and board bring-up tasks. -
Associate Electrical EngineerCollins Aerospace Jun 2018 - Jun 2020Charlotte, North Carolina, Us• Maintained and upgraded aerospace products as a hardware engineer, including tasks such as schematic capture, PCB design, electro-mechanical design, HSPICE circuit analysis, and component selection. Provided support for RF design testing and module development.• Performed hardware duties such as updating schematics and layouts, designing and testing high-speed DDR circuits using simulation tools like HyperLynx and Cadence, conducting interconnect testing, and analyzing derating, memory upgrades, stackups, and impedance.Improved signal and power integrity through timing analysis, impedance matching, and trace length matching. -
Graduate Research AssistantIllinois Institute Of Technology Jan 2018 - May 2018Chicago, Illinois, UsResearch Project with Dr. Erdal Oruklu, designing and comparing adder circuits in HSPICE and Python. The comparison criteria was with respect to the delay and power. Delay measurements were primarily made on the basis of RC and Elmore delay models and the power dissipation was calculated using the component values and activity factor of inputs. -
Hardware Engineer InternSmart Ag Solutions Llc Jun 2017 - Aug 2017• Developed testing and sensing hardware for farm vehicle automation by designing PCBs, managing wiring architecture, analysing the root causes of test failures, monitoring and controlling the different power inputs to the vehicle. • Managed test documents, PCB schematics and layouts, installation drawings and internal and customer documents.• Supported software, vision and mechanical teams with python scripting, prototype development and part installations.
Sid Deshpande Skills
Sid Deshpande Education Details
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Illinois Institute Of TechnologyElectrical Engineering -
Savitribai Phule Pune UniversityElectronics Engineering
Frequently Asked Questions about Sid Deshpande
What company does Sid Deshpande work for?
Sid Deshpande works for Formfactor Inc.
What is Sid Deshpande's role at the current company?
Sid Deshpande's current role is Principal Electrical Design Engineer at FormFactor Inc..
What is Sid Deshpande's email address?
Sid Deshpande's email address is si****@****rac.com
What schools did Sid Deshpande attend?
Sid Deshpande attended Illinois Institute Of Technology, Savitribai Phule Pune University.
What skills is Sid Deshpande known for?
Sid Deshpande has skills like Leadership, Hardware Architecture, Cadence Virtuoso, Signal Integrity, Test Automation, Digital Electronics, Aerospace Engineering, Linux, Autocad, Analog Circuit Design, Very Large Scale Integration, Integrated Circuits.
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