Sid Deshpande Email & Phone Number

Livermore, Ca, Us

• Designing microchips on Logic Probe Card Substrate (Organic and Ceramic) designs, including creating netlists, planning BGA floor layouts, and arranging 46-72 layer stack-up planning. • Reviewing physical layouts using Cadence Allegro.• Working on process development for Vertical Probe Cards technology• Driving design automation to fully automate the Substrate logical design process, helping improve design quality and efficiency.• Supporting major customers in the semiconductor industry for the probe card projects for their developing technology.

Waukesha, Wi, Us

• Responsible for development of microinverter hardware which includes design upgrades, schematics and layout improvements on Altium along with testing and calibration of the units/features, also in charge of interfacing with contract manufacturers (CMs) in east Asia regarding engineering changes(ECOs), component selection and process improvements. • Incharge or updates to engineering documents like Bill of Materials (BOM), design specification and validation plans.• Product management duties encompass supply chain management, electro-mechanical components sourcing, vendor relations and working with compliance standards for product improvements. • Lab work includes soldering and testing alternate components, capturing waveforms on oscilloscope and RMA analysis.• Other management tasks include collaborating with mechanical, firmware and layout teams to cross functionally develop the schedule for different prototypes and versions of the product.

Chatsworth, California, Us

• Collaborated with electrical designers and FPGA engineers to design high-speed circuits for new products.• Created and maintained electrical schematics and BOMs using Altium, and worked with the layout contractor and manufacturing team to design and fabricate PCBs.• Coordinated with Document Control, Purchasing, and the Stockroom, and provided weekly reports to upper management.• Tested prototypes in the design lab by programming ICs, debugging circuits, and performing minor soldering tasks.• Assisted with external testing lab interactions and completed python scripting and board bring-up tasks.

Charlotte, North Carolina, Us

• Maintained and upgraded aerospace products as a hardware engineer, including tasks such as schematic capture, PCB design, electro-mechanical design, HSPICE circuit analysis, and component selection. Provided support for RF design testing and module development.• Performed hardware duties such as updating schematics and layouts, designing and testing high-speed DDR circuits using simulation tools like HyperLynx and Cadence, conducting interconnect testing, and analyzing derating, memory upgrades, stackups, and impedance.Improved signal and power integrity through timing analysis, impedance matching, and trace length matching.

Chicago, Illinois, Us

Research Project with Dr. Erdal Oruklu, designing and comparing adder circuits in HSPICE and Python. The comparison criteria was with respect to the delay and power. Delay measurements were primarily made on the basis of RC and Elmore delay models and the power dissipation was calculated using the component values and activity factor of inputs.

• Developed testing and sensing hardware for farm vehicle automation by designing PCBs, managing wiring architecture, analysing the root causes of test failures, monitoring and controlling the different power inputs to the vehicle. • Managed test documents, PCB schematics and layouts, installation drawings and internal and customer documents.• Supported software, vision and mechanical teams with python scripting, prototype development and part installations.

Masters, Electrical Engineering

Bachelor Of Engineering (Be), Electronics Engineering