IC-Package Co-design & Co-simulation Enablement for mmWave application using Cadence Virtuoso-RF/VSDE ,EMX, Complete Front End Module design with Antenna in Package. Enabling Assembly design Kit (ADK) for IC-Package co-design for high frequency designs using GF 22FDX process technology.Carrier board design and simulation for mmWave applicationsEnabling design methodology for Photonics designs using 45SPCLO process. Aging & Fault analysis for ICs(Legato) using Cadence Virtuoso/Spectre.

Reliability Analysis at IC & Board level. Silicon Photonics , EM solvers, On chip passive extraction, EMX, CFD simulation & Thermal modeling. Spice Modeling. Circuit Design. Worked on SiGe HBT technology. IC-package co-design and simulationTransistor Level reliability analysis including aging and EMIR effects. Fault injection simulations , MTBF analysis. PCB Design and simulation. Signal Integrity analysis.Valid US Bussiness VISA holder

PCB Schematic design , familiar with board bring-up and testing.Designed SMD circuit for the previous non-SMD form using opto couplers/ Mosfet technology. Designed SMD based relay system. Verifying circuits, IC operation & performance.Coming up with a Micro controller MSP430 & AT89S52(C programming) based architecture to replace the present static analog circuit to meet the dynamic requirements of compatibility with different sensors and components.Worked with Standards including MIL-217, IEC62308, IEC61508, ISO26262 for MTBF predictions & FMEDADirect Interaction with customers for all design & quality issues.Production Line management, Sampling, Failure AnalysisManaged team of 40 people

BUILD SCRIPTS FOR AUTOMATIC GENERATION OF NETLISTS. STUDY OF FPGA EDA TOOLS. SHELL SCRIPTING. CIRCUIT DESIGNING.

Analog Synthesis of LDO Voltage regulators

CMOS circuit design, Semiconductor Fabrication