Siming Guo Email & Phone Number

California, United States

Livermore, Ca, Us

• Directly manage engineering team and cross functional projects to develop and execute reliability strategies to bring new designs from early R&D stages to high volume manufacturing.• Lead product life cycle testing, ongoing reliability monitoring programs, failure analysis, and root cause investigations for customer product issues using 8D problem solving and statistical controls.• Lead cross-functional operations and engineering team to increase capacity across production lines, improve customer on-time delivery, and reduce operating expenses. Presented milestone reviews to executives on project timelines, costs, and impacts.

Livermore, Ca, Us

• Lead projects that develop and improve materials characterization and product test methods for product reliability and performance assessment, yield improvement and cost reduction.• Collaborate with integration, design, modeling, test, reliability teams, and with other process development modules to develop, characterize and manufacture implementation of new Microelectromechanical systems (MEMS) structures.• Lead employee development on experiment design, test methodology, and laboratory characterization tools.

Livermore, Ca, Us

• Expert in prober card reliability tests (deformation, fatigue, creep, current-carrying), accelerated life tests (HALT, HASS), ongoing reliability monitoring (ORM) and Statistical Process Control (SPC).• Skilled in Microelectromechanical systems (MEMS) failure analysis, material characterization (SEM, EDS, FIB, FTIR, Microhardness, Nanoindentation) and functional performance investigations.• Take technical challenges to define, design and execute experiments in support of new MEMS structure design, fabrication technology innovations, and resolving custom escalations.• Experienced in conducting reliability test development, FMEA (failure mode and effect analysis), statistical data interpretation, and mechanical/material/thermal property characterization.

Livermore, Ca, Us

• Extensive hands-on experimental experience in using DIC, SEM, EDS, FIB, FTIR, Microhardness, NanoIndentor, 2D/3D computer vision and MTS/Instron testing system.• Developed and executed reliability test plans to qualify new MEMs products. Designed accelerated life tests and ongoing monitoring tests to ensure high product performance, quality, and reliability at customers’ sites• Ramped up microtensile material property testing capability for electroplated materials. New capability has improved accuracy of engineering analysis in all product development phases, reliability monitoring, and failure investigation• Skilled in use of SPC(statistical process control), JMP, DOE and six sigma methodology to support yield improvement, defect and process variability analysis, and technical problem solving.

Columbia, Sc, Us

• Project “SEM and AFM Imaging for Accurate Micro-scale and Macro-scale Measurements: Assessment and Validation of Digital Image Correlation Approaches for Thermal Strain Measurements”,Sponsor: Semiconductor Research Corporation (SRC)/Intel Corporation+ Improved Electron-Beam lithography and self-assembled nanoparticle surface technique to generate micro/nano-scale speckle patterns on metallic/composite material for metrology and characterization of specimens using SEM and AFM with DIC.+ Designed an integrated PID control system using high precision PI Piezo-nano-positioning stage and ZeissSEM to implement spatial and drift distortion correction on nano scale.+ Developed an effective and efficient methodology to quantify the inhomogeneous thermal deformation of nano-scale features on IC package from RT to 250°C.• Project “Modeling, Simulation and Sensing of Progressive Damage at Multiple Scales for Performance Prognosis in Metallic and Composite Aero Structures”,Sponsor: Air Force Office of Scientific Research (AFOSR)/DOD+ Developed a complete digital control system to experimentally study the progressive failure behavior of woven glass-epoxy composite specimens using MTS tensile machine, stereo computer vision, Honeywell load cell, strain gauge, oscilloscope, LabView and data acquisition systems.+ Employed 3D-DIC (Digital Image Correlation) to obtain highly non-uniform full-field strain fields of the heterogeneous specimen undergoing both bending and compression load.+ Theoretically analyzed the reliability and failure of woven composite specimen using elastic/plastic mechanics, fracture mechanics and material science.+ Modeled and numerical analyzed the deformed structure and corresponding damage using Matlab and Ansys for failure analysis.

Columbia, Sc, Us

• EMCH362 Mechanical Engineering Lab II

Fremont, Ca, Us

+ Investigated contamination and defect issues from slider/HGA/HSA in process failures, electronic test failure and drive failure using various characterization techniques (optical scope, SEM, AFM, ToFSIMS, Auger, etc.). + Worked with teams in Thailand, Malaysia and China for quality control of hard disk drive and statistical analysis of the failure mode. + Practical experience of data mining and Pareto analysis in JMP. Working knowledge of DOE and six sigma methodology.

上海, Shanghai, Cn

• Project “High density flip-chip bonding machine and its key technology and equipment” in Research Institute of Robotics, SJTU, China

上海, Shanghai, Cn

• Manufacturing Processes and Systems, EMBA Course of CLFM (China Leaders for Manufacturing Program)

Doctor Of Philosophy (Phd), Mechanical Engineering

Bs, Mechanical Engineering