Siming Guo Email & Phone Number

California, United States

Livermore, CA, US

• Directly manage engineering team and cross functional projects to develop and execute reliability strategies to bring new designs from early R&D stages to high volume manufacturing.
• Lead product life cycle testing, ongoing reliability monitoring programs, failure analysis, and root cause investigations for customer product issues using 8D problem solving and statistical controls.
• Lead cross-functional operations and engineering team to increase capacity across production lines, improve customer on-time delivery, and reduce operating expenses. Presented milestone reviews to executives on project.

Livermore, CA, US

• Lead projects that develop and improve materials characterization and product test methods for product reliability and performance assessment, yield improvement and cost reduction.
• Collaborate with integration, design, modeling, test, reliability teams, and with other process development modules to develop, characterize and manufacture implementation of new Microelectromechanical systems (MEMS).
• Lead employee development on experiment design, test methodology, and laboratory characterization tools.

Livermore, CA, US

• Expert in prober card reliability tests (deformation, fatigue, creep, current-carrying), accelerated life tests (HALT, HASS), ongoing reliability monitoring (ORM) and Statistical Process Control (SPC).
• Skilled in Microelectromechanical systems (MEMS) failure analysis, material characterization (SEM, EDS, FIB, FTIR, Microhardness, Nanoindentation) and functional performance investigations.
• Take technical challenges to define, design and execute experiments in support of new MEMS structure design, fabrication technology innovations, and resolving custom escalations.
• Experienced in conducting reliability test development, FMEA (failure mode and effect analysis), statistical data interpretation, and mechanical/material/thermal property characterization.

Livermore, CA, US

• Extensive hands-on experimental experience in using DIC, SEM, EDS, FIB, FTIR, Microhardness, NanoIndentor, 2D/3D computer vision and MTS/Instron testing system.
• Developed and executed reliability test plans to qualify new MEMs products. Designed accelerated life tests and ongoing monitoring tests to ensure high product performance, quality, and reliability at customers’ sites
• Ramped up microtensile material property testing capability for electroplated materials. New capability has improved accuracy of engineering analysis in all product development phases, reliability monitoring, and.
• Skilled in use of SPC(statistical process control), JMP, DOE and six sigma methodology to support yield improvement, defect and process variability analysis, and technical problem solving.

Columbia, SC, US

• Project “SEM and AFM Imaging for Accurate Micro-scale and Macro-scale Measurements: Assessment and Validation of Digital Image Correlation Approaches for Thermal Strain Measurements”,Sponsor: Semiconductor Research.
• Project “Modeling, Simulation and Sensing of Progressive Damage at Multiple Scales for Performance Prognosis in Metallic and Composite Aero Structures”,Sponsor: Air Force Office of Scientific Research (AFOSR)/DOD+.

Columbia, SC, US

• EMCH362 Mechanical Engineering Lab II

Fremont, CA, US

+ Investigated contamination and defect issues from slider/HGA/HSA in process failures, electronic test failure and drive failure using various characterization techniques (optical scope, SEM, AFM, ToFSIMS, Auger, etc.). + Worked with teams in Thailand, Malaysia and China for quality control of hard disk drive and statistical analysis of the failure mode..

上海, Shanghai, CN

• Project “High density flip-chip bonding machine and its key technology and equipment” in Research Institute of Robotics, SJTU, China

上海, Shanghai, CN

• Manufacturing Processes and Systems, EMBA Course of CLFM (China Leaders for Manufacturing Program)

Doctor Of Philosophy (Phd), Mechanical Engineering

Bs, Mechanical Engineering