Simon Yang Email and Phone Number
Simon Yang work email
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Simon Yang personal email
Skills• Hands-on experiences in production support from a high volume semiconductor manufacturing• Extensive exposure in technical discussion and interface with customers• Effective communication skills, strong and matured leadership• Strong technical know how on IC products, materials and processes• Knowledge in semiconductor foundry and assembly equipment operation • Highly exposure in new material, new device, new package qualification, characterization and D.O.E.• Knowledge in cost saving programs by developing new techniques and system approach on existing process• Handles complex process operation or technical issues• Extensive technical experience combination between semiconductor foundry fab and assembly OSATs.Certifications/License1. Six Sigma Green Belt Certification.2. TOEIC 755
美光科技
View- Website:
- micron.com
- Employees:
- 20793
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Quality Engineering Manager美光科技 Apr 2022 - Present台灣 臺中市
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Senior Global Quality EngineerMicron Technology Jun 2019 - PresentTaichung City, Taiwan
1) Cross-function and cross-site process criteria alignment and standardization.2) CTQ list alignment for process control and monitor the process health.3) Deep diving on 8D, RMA and inline excursion with exploring new control points.4) Quality escape point investigation and enhancement on the detection point.5) Post assembly and post electrical test inspection consolidation for process control.6) Embed the CTQ list into FMEA and control plan as the process monitor.7) Network alignment and quality review for issues triggered from sites and OSATs.8) NPI Phase gate review for new product introduction.9) AIAG VDA pFMEA compliance and deployment.10) Change management control and review for any conversion. 1) Control point hardening for escape points.2) FMEA and QCP alignment for CTQ lists.3) Establish business processes complied to global standards -
Sr. Assembly Process EngineerMicron Technology Jul 2017 - Jun 2019Taichung City, Taiwan1) Process setup for wafer preparation of PoP and 3DI assembly.2) Figure out the root cause and solution for the inline issues. 3) Find out the best process window and optimize process conditions.4) Yield detractor analysis for yield enhancement.
1) Team leader for wafer preparation starting up of back grinding, dicing, laser DAF cut, die separation, and UV cure processes.2) Process window evaluation and optimization for WPH improvement. 3) FMEA and control plan deployment and management. 4) Assembly process development and yield enhancement5) Problem solving by applying DOE, FA, FMEA, 8D and SPC methodology.6) Cross-function and cross-site BKM alignment and fan-out activities.7) Coordinate audit activities for assembly processes and reply actions.8) Qualify new machines and new materials to achieve same quality requirement. 1) WPH Improvement for processes.2) Die crack improvement by optimizing BG/SAW process parameters.3) NCF process and machine buyoff.4) pFMEA and control plan consolidation5) Process characterization for recipe standardization.6) ISO audit preparation. -
Senior Product EngineerAmkor Technology Dec 2015 - Jun 2017湖口1) In charge of STM WLCSP NPI.2) Provide technical assistance to the customer.3) New device SPEC discussion, evaluation and qualification 4) Assembly process development and yield enhancement1) Communicate and identify the requirements with STM for all WLCSP devices.2) Coordinate with all modules to come out better conditions for mass production yield improvement activities.3) Yield analysis to figure out the failure root cause and DOE validation.4) Evaluate appropriate WLCSP process flow and conditions. 1) Laser grooving evaluation for topside chipping improvement on low-K devices.2) Sawing parameter evaluation for backside chipping improvement.3) Magnification and ROI evaluation for AOI inspection4) MTT(Marking Through Tape) evaluation. -
Senior Specialty Technology Development EngineerUnited Microelectronics Corporation (Umc) Nov 2013 - Aug 2015Singapore1) Deliver health process for CMOS image sensor 2) Find out the best process window 3) Patents and Paper study to come out new ideas 4) New tools and materials survey1) Co-work with STMicroelectronics to develop BSI CMOS image sensor device. 2) Coordinate with all modules to come out new idea for necessary process to implement Don the product. 3) Yield analysis to figure out the failure root cause and narrow down the split conditions. 4) Evaluate appropriate method to monitor inline abnormal. 1) Deep trench isolation structure evaluation2) White Pixel/Dark Current reduction project for photodiode -
Process Engineer3M Apr 2011 - Jun 20131) Adhesive converting process improvement. 2) Process issue solving 3) Yield enhancement 4) New materials implementation1) OCA jumbo slitting, converting, inspection and packaging for OCA products.2) Operation manual preparation for new equipment releasing.3) BOM generation for all products.4) Unit cost calculation for all OCA products. 1) Automaton slitter evaluation.2) SAP system implementation -
Senior Process Integration EngineerNanya Technology Feb 2006 - Apr 20111) BEOL process integration handling2) Figure out the root cause and solution for the inline issues. 3) Find out the best process window. 4) Analyze yield detractors for yield enhancement.5) New generation technology implementation.1) 110nm Trench process Backend of line maintenance, March 2006 – September 2006 2) 90nm Trench process Backend of line process development, October 2006 - April 2007. 3) 90nm Trench process pilot run at the new 12” fab, August 2007 – February 2008. 4) 68nm Stack process pilot run, January 2009 – May 2009.5) 42nm Stack process pilot run, August 2010 – Feb 2011. 1) 2008 April, stack prose 68nm workshop in Singapore. 2) 2009 November – 2010 January, 42nm stack process transfer program in Boise U.S.A. 3) 2010 April, 42nm generation workshop in Singapore. 1) Negative PIQ implementation for stack DRAM process. 2) Al bond pad implementation.
Simon Yang Skills
Simon Yang Education Details
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Chemistry And Material Engineering -
Applied Sciences And Technologies
Frequently Asked Questions about Simon Yang
What company does Simon Yang work for?
Simon Yang works for 美光科技
What is Simon Yang's role at the current company?
Simon Yang's current role is Global Quality, Control Engineering Manager(Integrated Network Control) at Micron Technology.
What is Simon Yang's email address?
Simon Yang's email address is si****@****kor.com
What schools did Simon Yang attend?
Simon Yang attended Chang Gung University, National Chiao Tung University.
What skills is Simon Yang known for?
Simon Yang has skills like Six Sigma, Problem Solving, Punch Press, Process Improvement, Process Engineering, Quality Management, 5s, Design Of Experiments, Fmea, Materials Science, Failure Analysis, Process Integration.
Who are Simon Yang's colleagues?
Simon Yang's colleagues are Kai Min Chua, Michael Milhoan, Karl Christian Rottmann, Tyler Davis, Ms, Csp, Feng Chuang, Teresa Harrington, Ashish Singh.
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Simon Yang
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Simon Yang
Sr. Project Manager | Pre-Sales, Technical Consulting | Innovative Ai Industry, AiotTaipei–keelung Metropolitan Area -
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