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@samtec.com
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Steve Groothuis is listed as Semiconductor Advanced Packaging, R&D, Simulations, Technical Program Management, and Support Defense Contract Proposals at Texas Institute for Electronics, based in Meridian, Idaho, United States. AeroLeads shows a work email signal at samtec.com, phone signal with area code 719, 812, and a matched LinkedIn profile for Steve Groothuis.
Steve Groothuis previously worked as Director of Special Projects at Texas Institute For Electronics and Retired at Ayar Labs. Steve Groothuis holds Masters Of Science, Physics from The University Of Texas At Dallas.
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AeroLeads found 2 current-domain work email signals for Steve Groothuis. Compare company email patterns before reaching out.
With over two years of experience as a Technical Fellow and Senior Technologist at Ayar Labs, Steve is a seasoned expert in semiconductor, MEMS, biomedical device, and optical packaging, who has also managed IP portfolio, patent transactions, technical program management, and government contracts. He has also contributed to the development of innovative solutions for I/O bandwidth and power bottlenecks using in-package optical I/O with silicon photonics.Steve has a strong background in R&D, product development, and technology strategy, with multiple patents and Coursera certifications in data science and engineering. He is a continuous learner, who is flexible and eager to learn new processes, and a collaborative leader, who has coordinated technical activities of internal and external teams. He is passionate about helping high-tech companies to improve product manufacturability, performance, quality, testability, and reliability.
Listed skills include Semiconductors, Simulations, R&D, Finite Element Analysis, and 46 others.
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Based out of The University of Texas at Austin, Texas Institute for Electronics (TIE) is a public-private partnership focused on advanced package solutions centered on heterogeneous integration. My role will be targeted at developing wafer-level assembly (WLA) procedures, providing insights on modeling & simulation, and determining key attributes for.
San Jose, California, US
Managed IP portfolio & patent transactions Provide semiconductor, optical, photonics, and sensor packaging expertise Principal Investigator on DoD’s KANAGAWA Laser, Optical IO Chiplet, & Packaging contract (through US Navy Crane - NSWC)
San Jose, California, US
Working with internal & external teams >> solve I/O bandwidth and power bottlenecks >> moving data using light via in-package optical I/O (with silicon photonics) >> enabling the next phase of Moore's Law. Managing development timelines, execution, exit criteria, deliverables, risks, resourcing, etc. on government projects.Coordinating all technical.
Neenah, WI, US
Managing P&L metrics for Plexus' Microelectronics Assembly Factory.Provide effective manufacturing and operational management, strategies, quality, delivery, revenue, profitability, and customer satisfaction objectives.
Santa Clara, California, US
Transfer engineering process from technology development to high volume manufacturing for Intel’s Foveros 3D wafer level assembly technology.
Satellite Beach, Florida, US
Providing open innovation plans, technology insights, and applying first-principles to engineering issues.
New Albany, IN, US
Boise, Idaho, US
Responsible for technology pathfinding activities (in memory packaging solutions) through internal/external research and process groups. In order for pathfinding to be valuable, my team provides:1) Drive ACCURATE TECHNOLOGY ANALYSES to direct development with new rules, Technical Risk Assessments (TRA's), and guidelines.2) Produce FORWARD-LOOKING RESULTS.
Boise, Idaho, US
Provide simulation and project technical support in areas of product and process development for Advanced & Emerging Memory technologies. Simulation techniques include Finite Element Analysis (FEA), Computational Fluid Dynamics (CFD), and Electromagnetic Analyses. Our group focus is on predicting micro- and nanomechanical behaviors and emerging.
Oro Valley, AZ, US
Teach several short courses in Package Design & Modeling, MEMS Packaging, and MEMS Technology in US, Europe, and Asia-Pacific since 2003.
Rochester, New York, US
Develop new business opportunities for Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD) consulting projects in vertical markets such as Microelectronics, Semiconductor Packaging, Wafer Fabrication, NEMS/MEMS, Nanotechnology, Solar Energy, Wind Energy, Consumer Electronics, etc.Consult with clients and perform pertinent Computer-Aided.
Boise, Idaho, US
Supervised Technology CAD engineers performing device physics simulations (e.g., semiconductor process and device performance). Provided multiphysics simulations for wafer fabrication, product reliability, advanced semiconductor packaging, MEMS operations, and advanced memory device.
Boise, Idaho, US
Performed multiphysical simulations and suppported device physics in R&D Group.
Boise, Idaho, US
Performed semiconductor assembly and packaging simulations, package reliability, material characterization, and other related advanced simulation studies.
Dallas, TX, US
Taught two semesters of a graduate Mechanical Engineering course (ME8364) entitled "Applied FEM Simulations of Manufacturing Processes". Class projects included simulation of Friction Stir Welding, Waterjet Cutting/Boring, Laser Metal Deposition, etc.
Canonsburg, PA, US
Worked within SE USA Sales District with major accounts located throughout the US. Main focus was electronics and semiconductor companies (i.e., pre-sales support, post-sales technical support, and purchase forecasting).
Canonsburg, PA, US
Developed ANSYS's MEMS Marketing and Product Development Initiatives. Provided worldwide marketing events throughout all of Asia-Pacific region (as invited speaker at all major User Group Meeting). Produced various levels of marketing collateral.
Dallas, TX, US
Managed a group of 19 researchers, packaging engineers, and technicians to support corporate-wide package development activities. This group provided materials characterization, reliability testing, and various levels of simulations (i.e., electrical, thermal, and structural types).
Dallas, TX, US
Co-developed various sustaining and advanced package types for multiple product groups within TI. Provided test structure development, testing, and evaluation related to package materials and assembly process assessments.
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Steve Groothuis works for Texas Institute for Electronics.
Steve Groothuis is listed as Semiconductor Advanced Packaging, R&D, Simulations, Technical Program Management, and Support Defense Contract Proposals at Texas Institute for Electronics.
AeroLeads has found 2 work email signals at @samtec.com for Steve Groothuis at Texas Institute for Electronics.
AeroLeads has found 2 phone signal(s) with area code 719, 812 for Steve Groothuis at Texas Institute for Electronics.
Steve Groothuis is based in Meridian, Idaho, United States while working with Texas Institute for Electronics.
Steve Groothuis has worked for Texas Institute For Electronics, Ayar Labs, Plexus Corp., Intel Corporation, and Self Employed.
You can use AeroLeads to view verified contact signals for Steve Groothuis at Texas Institute for Electronics, including work email, phone, and LinkedIn data when available.
Steve Groothuis holds Masters Of Science, Physics from The University Of Texas At Dallas.
Steve Groothuis is listed with skills including Semiconductors, Simulations, R&D, Finite Element Analysis, Characterization, Electronics, Ansys, and Materials Science.
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