Based out of The University of Texas at Austin, Texas Institute for Electronics (TIE) is a public-private partnership focused on advanced package solutions centered on heterogeneous integration. My role will be targeted at developing wafer-level assembly (WLA) procedures, providing insights on modeling & simulation, and determining key attributes for advanced packaging solutions, lea

Managed IP portfolio & patent transactions Provide semiconductor, optical, photonics, and sensor packaging expertise Principal Investigator on DoD’s KANAGAWA Laser, Optical IO Chiplet, & Packaging contract (through US Navy Crane - NSWC)

Working with internal & external teams >> solve I/O bandwidth and power bottlenecks >> moving data using light via in-package optical I/O (with silicon photonics) >> enabling the next phase of Moore's Law. Managing development timelines, execution, exit criteria, deliverables, risks, resourcing, etc. on government projects.Coordinating all technical activities of Ayar Labs’ silicon photonics package integration programs.

Managing P&L metrics for Plexus' Microelectronics Assembly Factory.Provide effective manufacturing and operational management, strategies, quality, delivery, revenue, profitability, and customer satisfaction objectives.

Transfer engineering process from technology development to high volume manufacturing for Intel’s Foveros 3D wafer level assembly technology.

Providing open innovation plans, technology insights, and applying first-principles to engineering issues.

TECHNICAL GUIDANCE• Wafer fabrication (including Far BEOL) & packaging leader who oversaw demonstration test vehicles and debugged new assembly & package innovations. • An active package architect who drove package architectures and elements such as System in Package (SiP), silicon photonics, Thin Film Deposition (PVD), Copper Electrodeposition, Through Glass Vias (TGV), and Redistribution Layer (RDL) solutions. • Involved in technical marketing, technology, & process development for clients in market sectors of military, aerospace, biomedical (DNA sequencing and ultrasound), MEMS & Sensors, CMOS Image Sensors, AV LIDAR, electro-optical, heterogeneous integration, and AI packaged products.STRATEGIST• Technical adviser to other senior management in all matters related to or involving advanced packaging. • Technical analyst who was involved in technology market trends for direct strategies and organizational influence. • Technical leader in development of Samtec’s overall technology roadmap (i.e., process development and pathfinding).INTERNAL ADVISOR• Have been a trusted company spokesman who delivers technically focused presentations to external community and demonstrates Samtec’s technical expertise in packaging. • Trusted adviser who provided investment recommendations to senior management on strategic packaging and product initiatives using on technical and business expertise. • Assisted recruiters in finding key front-end and back-end engineers.TECHNOLOGY ASSESSOR• Completed several business and technical intelligence gathering resulting in successful acquisition of a glass substrate and interposer company for packaging of various device technologies. • Had consistent Return on Investment (ROI) and Business Intelligence (BI) philosophies to help with any new business planning.

Responsible for technology pathfinding activities (in memory packaging solutions) through internal/external research and process groups. In order for pathfinding to be valuable, my team provides:1) Drive ACCURATE TECHNOLOGY ANALYSES to direct development with new rules, Technical Risk Assessments (TRA's), and guidelines.2) Produce FORWARD-LOOKING RESULTS that allow a product to yield throughout development phase, manufacturing, reliability characterization, and normal use.3) Provide STRATEGIC CONSULTING, including technology roadmap and establishing assembly and packaging strategies for next-generation memory solutions.4) Drive change through TECHNOLOGY AWARENESS (i.e., product design, materials, processes, and equipment).5) Promote STRONG DfX APPROACHES (X = Manufacturability, Reliability, Performance, Cost, etc.) to technology development activities and within associated engineering groups.

Provide simulation and project technical support in areas of product and process development for Advanced & Emerging Memory technologies. Simulation techniques include Finite Element Analysis (FEA), Computational Fluid Dynamics (CFD), and Electromagnetic Analyses. Our group focus is on predicting micro- and nanomechanical behaviors and emerging semiconductor technologies. Provide complete engineering solutions to problems involving manufacturability, performance, and reliability for TSV-based 3D packaging, Micron's Hybrid Memory Cube (HMC), and advanced wafer fabrication processes.

Teach several short courses in Package Design & Modeling, MEMS Packaging, and MEMS Technology in US, Europe, and Asia-Pacific since 2003.

Develop new business opportunities for Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD) consulting projects in vertical markets such as Microelectronics, Semiconductor Packaging, Wafer Fabrication, NEMS/MEMS, Nanotechnology, Solar Energy, Wind Energy, Consumer Electronics, etc.Consult with clients and perform pertinent Computer-Aided Engineering (CAE) simulations for many types of electrical, mechanical, and physics-related phenomena. Provide engineering solutions for issues in the areas of manufacturability, reliability, and performance through design, process, and material recommendations.

Supervised Technology CAD engineers performing device physics simulations (e.g., semiconductor process and device performance). Provided multiphysics simulations for wafer fabrication, product reliability, advanced semiconductor packaging, MEMS operations, and advanced memory device.

Performed multiphysical simulations and suppported device physics in R&D Group.

Performed semiconductor assembly and packaging simulations, package reliability, material characterization, and other related advanced simulation studies.

Taught two semesters of a graduate Mechanical Engineering course (ME8364) entitled "Applied FEM Simulations of Manufacturing Processes". Class projects included simulation of Friction Stir Welding, Waterjet Cutting/Boring, Laser Metal Deposition, etc.

Worked within SE USA Sales District with major accounts located throughout the US. Main focus was electronics and semiconductor companies (i.e., pre-sales support, post-sales technical support, and purchase forecasting).

Developed ANSYS's MEMS Marketing and Product Development Initiatives. Provided worldwide marketing events throughout all of Asia-Pacific region (as invited speaker at all major User Group Meeting). Produced various levels of marketing collateral.

Managed a group of 19 researchers, packaging engineers, and technicians to support corporate-wide package development activities. This group provided materials characterization, reliability testing, and various levels of simulations (i.e., electrical, thermal, and structural types).

Co-developed various sustaining and advanced package types for multiple product groups within TI. Provided test structure development, testing, and evaluation related to package materials and assembly process assessments.