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Corvallis, Oregon Area

WAC 2015 raised a $455,000 investment from 47 individual investors, the Oregon Growth Board, the Oregon Community Foundation and the Meyer Memorial Trust. Moonshadow Mobile of Eugene, a big data storage and analysis company, won the investment.

Corvallis, Oregon, United States

As Oregon's first "Signature Research Center", ONAMI led a highly successful collaboration among Oregon's research universities, PNNL and industry to grow materials-related research, shared user facility capabilities and research commercialization. ONAMI's pioneering commercialization GAP fund has generated $427M in leveraged funding and over 290 Oregon jobs in ~40 science-based startup companies originating from Oregon's research universities and independent entrepreneur-inventors.

Portland, Oregon Area

OVF is Oregon's largest early stage investor, with high-performing annual funds driven by a unique combination of professional management and member-investor outreach, diligence and portfolio support.

Corvallis, Oregon Area

The Willamette Angel Conference LLCs and related year-round W2 fund, have made some of the largest angel conference investments in Oregon. WAC invests statewide, but is rooted in the highly capable Corvallis/OSU and Eugene/UO research university communities.

NTV is an early-stage equity investor in Oregon technology companies, most often based on university research commercialization.

Innovation management, technology-based economic development, organizational development, and expert witness services for industrial, educational, and research institutions in the area of high technology. This activity led directly to the founding of ONAMI.

Responsible for intellectual property, technology roadmap strategy and execution for future thermal inkjet products and new business opportunities based on HP's extensive materials and microtechnology capabilities. Responsible for product platform and manufacturing process development for the thermal inkjet printheads used in most generations of the HP DeskJetTM, OfficeJetTM, and DesignJetTM product families. Technology leadership highlights during this period include: micro-machined TIJ processes, laser ablated orifices merged with flexible interconnect, Analog/Digital/Power CDMOS merged with TIJ thinfilms and photopolymer barriers, photographic image printing with ultra-small drop volumes, 3D fluidic/mechanical/electrical assembly and interconnect development, ink formulation to eliminate color bleed and improve water resistance, volume-efficient ink delivery/containment systems, reliability improvement (weeks to years), and supercomputer modeling. Business highlights during this period include world leadership (unit share, value share, financial performance) in desktop and large format printing, seed business plans based on new IP, and new businesses launched as a result of investments in application development.

Responsible for development of CMOS process technology, custom IC designs and design tools, and proprietary IC packaging solutions for HP ASICs. Technology leadership highlights during this period included 1 Mb DRAM - parity CMOS ASIC technology (world leader), custom design placements in most HP product families, tape-automated bonding, and multi-chip hybrids for HP calculators.

Responsible for CMOS ASIC silicon technology development at HP's Northwest Integrated Circuit Division. We developed the world's most advanced CMOS ASIC technology for both HP products and selected external customers.

Leadership of a technology comparison taskforce which established that compound semiconductor VLSI would encounter performance limitations relative to silicon due to interconnect capacitance effects.

Nominated to represent HP as an exchange researcher in the field of CMOS technology. Numerous technical publications resulted from this year-long assignment. Learned to speak and read Japanese at an elementary level.

CMOS process development

Ms, Electrical Engineering

Masters research project: development of measurement techniques using a stepping spreading resistance probe to extract vertical doping.

Bs, Electrical Engineering

Activities and Societies: Tau Beta Pi Phi Beta Kappa (Jr. Year) Frederick E. Terman Engineering Award, 1976