Research Chemist
CurrentPerforming a wide variety of electrochemical experiments (EIS, LSV, CVS) involving additive assisted Cu plating for integrated circuits. Researching the mechanism of action of various proprietary organic additives to establish structure-function relationships to ultimately improve the performance of our products. Performing benchtop scale electroplating experiments on integrated circuit test panels to establish and improve additive and VMS formulations in order to achieve peak plating performance according to customer requirements.