Sébastien Libon Email & Phone Number

Eindhoven Area

Full time employeneur contracted to work for CITC

Nijmegen, Gelderland, Netherlands

Responsible for research activities in electronic packaging in power and RF application. Deep expertise in compound semiconductors, die attachment, interconnect and thermal measurements.

Washington DC-Baltimore Area

• Consultant in Manufacturing, Innovation, & Community Services September 2018 – Present
• Sabbatical: graduate certificate in Microdevices and Microsystems at the Stevens institute of technology
• Design of a vibration sensor for a passive middle ear replacement implant
• Concept design of a tabletop integrated roaster/grinder/coffee machine
• Tutoring and mentoring in sciences, mathematics, and French for middle and high school.
• Coaching field hockey teams U10-U16

Charleroi Mont-sur-Marchienne, Wallonie, Belgique

• Guaranteed a flow of engineering efforts to lateralize design, enabling designers to take account of manufacturing aspects from beginning while maintaining independence
• Reviewed hardware designs in order to certify proper production on first try
• Consolidated Design for Manufacturing/Excellence practices to improve Failure Modes & Effects Analysis
• Instituted design rules to relax redundancy constraints, slashing costs by 35% for recurrent launcher products (Ariane 6)
• Formulated new partnerships through shared equipment and resources which generated institutional grants for projects

Charleroi Area, Belgium

• Completed hardware re-vamp of hermetic low power DCDC converter for space by using low cost conventional technologies, effecting a cost reduction of 20% in supplies and 35% in manufacturing
• Orchestrated introduction of Gan FET through new hermetic packaging concept; led to substantial reduction of electrical losses in high-power converters as well as widespread capabilities across multiple applications
• Solved endemic reliability problems through deep data analysis, auditing, and Design of Experiment to gain a better yield that restored customer confidence
• Guided engineers and new hires with projects and production investments

Eindhoven Area, Netherlands

• Invented new low-cost, large area LED lighting with electronic packaging and contracted with major players such as Apple
• Developed additive manufacturing capabilities which prompted a venture of 3D-printed luminaires
• Integrated roll-to-roll processing for textile to create lighting mass production techniques, forming a large partnership
• Led architecture to produce highly competitive, glass-sealed LED bulb to achieve maximum thermal performance, causing 30% increase in efficiency while keeping a traditional low-cost bulb
• Secured patent to simplify niche business production sorting through creation of color temperature adjustable LED benches

Eindhoven Area, Netherlands

• Established manufacturing process for semiconductor stepper module based on thousands of µ-aligned VCSEL lasers; implemented DoE, SPC, and other statistical tools to kick-off production while exceeding expectations in.
• Studied “brain pacemaker” module and electrode for startup, turning it into “in the body” acute Parkinson disease treatment
• Introduced new interconnect material for PCB after study and selection between numerous emerging technologies, offering resilience for higher component temperatures and higher thermal transfer
• Assembled piezoelectric kidney stones blaster head through a 3D-flex circuit, potentially leading to new therapy treatment
• Analyzed bankcard reliability through x-ray analysis to determine process improvement methods
• Directed new employees in developing a knowledge matchmaking tool of Philips researcher profiles – resulted in bid for a fully funded ESA project on solders

Charleroi Area, Belgium

• Dealt with process for wire bonding interconnect and temperature cycling
• Arranged production line continuous improvement through SPC of interconnect and component placement, increasing yield by 5% and reducing production time
• Selected and validated high performance die attach materials through ESA evaluation qualification process, enhancing thermal transfer by a factor of 2.5 and decreasing diversity of solutions
• Managed Scanning Acoustic Microscopy for product inspection validation and troubleshooting – spearheaded business case, selected equipment, and launched use of new method in factory
• Specialized in hybrid micro-electronic packaging for space applications in a 50-person production facility, handling long-term technological breakthroughs with new packaging for power electronic space applications
• Focused on continuous improvement through recurrent cost reduction, manufacturing strategies, process data mining, interconnection, environmental and leak testing, fundamental studies of technological opportunities.

Greater New York City Area

• Produced new LED package using flip-chip wafer level technology; became first high brightness white LED demonstrator of GE
• Created LED chip scale packaging using ceramic substrates
• Built an LED pilot line with several teams in different states and surpassed objectives thanks to Six Sigma Black Belt knowledge
• Supervised conventional LED sampling and testing facility
• Designed package for photodiode arrays with light-fiber alignment

Charleroi Area, Belgium

• Manufactured non-hermetic packaging for space power hybrids through selection and testing of dam and fill solutions
• Led robustification of wire-bonding processes using DoE and SPC, defining a standardized approach of parameter setting for ball bonding interconnect
• Invested and introduced new wire bonding equipment for ball and wedge bonding
• Coordinated Y2K passage of production facility equipment, producing a flawless transition and better safeguarding data

Liège Area, Belgium

Master Of Science - Ms, Materials Science And Engineering

Full master in engineering (polytechnique) with a major in materials science.

Graduate Certificate, Microdevices And Microsystems, Gpa Of 4.0