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Smith Harry is listed as Digital circuit design engineer at 壁仞科技, based in Shanghai, China, China. AeroLeads shows a matched LinkedIn profile for Smith Harry.
Smith Harry previously worked as Digital circuit verification engineer at 高云半导体 Gowin Semiconductor Corp. Smith Harry holds 硕士, 电子学 from 新加坡南洋理工大学.
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壁仞科技IP设计工程师
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1.Low speed universial interface IP design2.Security related IP self-developed(RSA,SM2,SM3, SM4).3.Security related patent application.4.Security sub-system integration and chip-level security scenario.5.National secret authentication developer.6.knowledge about AMBA, including APB and AXI.7.DMA related self-developed(SDMA and CP DMA)8.Lint and STA check.
中国 山东省 济南
1.Algorithm related self-design IP verification2.Writing automated simulation scripts3.Writing verification spec and testplan
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Smith Harry works for 壁仞科技.
Smith Harry is listed as Digital circuit design engineer at 壁仞科技.
Smith Harry is based in Shanghai, China, China while working with 壁仞科技.
Smith Harry has worked for 壁仞科技 and 高云半导体 Gowin Semiconductor Corp.
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Smith Harry holds 硕士, 电子学 from 新加坡南洋理工大学.
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