was working as a technical lead on Automotive boards. I had to quit in 6 months since the project got cancelled.

• Spearheading the design and development of wireless-enabled products, ensuring seamless integration of RF, Trace RF, BLE, Wi-Fi, 5G, and GPRS technologies.• Leading the incorporation of diverse peripherals and interconnects, such as CAN, USB3.0, HDMI, Ethernet, I2C, SPI, PMIC, and MIPI, to enhance device functionality and performance.• Collaborating with cross-functional teams to evaluate and select the most suitable components, ensuring optimal compatibility and system efficiency.• Proficiently interfacing with SRAM, LPDDR3, and LPDDR4 memories to meet demanding data processing requirements and maximize device speed and responsiveness.

• Leading RF design initiatives for Automotive Grade projects, ensuring compliance with stringent industry standards and specifications.• Conducting thorough feasibility studies and analysis to identify optimal board layouts and placements for RF components.• Employing microstrip, stripline, and coplanar routing techniques to minimize signal loss, impedance mismatch, and electromagnetic interference.• Collaborating closely with cross-functional teams, including hardware engineers and product managers, to integrate RF designs seamlessly into automotive systems.• Conducting rigorous testing and validation to verify RF performance and functionality, iterating designs as necessary to achieve superior results.

• Spearheading the design and layout of high-frequency Printed Circuits, focusing on RF impedance control and signal integrity.• Incorporating High-Density-Interconnect technologies to optimize space and enhance performance in complex circuit designs.• Collaborating closely with hardware engineers and product development teams to create innovative Base-Band and RF circuits for cutting-edge wireless communication semiconductor solutions.• Conducting impedance control calculations (50-ohms, 90-ohms, 100-ohms, 120-ohms) to ensure precision in signal transmission.• Expertly handling high-speed routing, length matching, and phase matching to maintain signal integrity in high-frequency designs.• Implementing advanced PCB concepts such as blind and buried vias, cutouts, via on pad, and back drilling for improved board performance.• Designing Single to multilayer boards, including Rigid and Flex designs, to accommodate diverse project requirements.