 13+ Years of innovative and progressive professional experience in Printed Circuit Board & Package design Development with excellence skills.Targeting more contributing ventures in PCB and HARDWARE domain and accelerate company’s productivity goals and engineering services. Layout experience on High speed interfaces like (Intel Boards - Cannonlake – Intel’s first 10nm CPU line, LPDDR3, LPDDR4, DDR5), QDR, PCI, PCI Express, M.2, U.2, THUNDERBOLT, PHY, SERDES, OPTICAL, RF, HDMI & Hi-Speed Network cards, Worked on up to 1.28Tb/s hi-speed design & Etc..Hands on experience on Difference, Aerospace, Medical projects, industrial, and Auto motives. Schematic Entry High current Application. High Density Interconnect. Gerber generation & checking using CAM tool and DRC reports. 3D STEP MODELS, EMN, EMP & DXF Import & Export for mechanical feasible. Performed design constraint requirements (i.e. Differential Routing, Controlled Lengths/Delay, Cross talk Control,” 0” angles routing & Arc Routing etc.) Used Split Power Planes technology to reduce the number of overall layers Designed in fine pitch devices and micro via technology and design. Experience in using blind and buried via’s. Tools Used: Allegro from Cadence 15.7, 16.0, 16.2, 16.3 & 16.5, 16.6, 17.2, & 17.4ALTIUM DESIGNER MENTOR GRAPHICS PADS etc... Designed the following type of PCB’s Analog Design Digital Design Angle Diff pairs & single ended  Through Hole / SMD / Blind & Buried via Technology, Back drilled PCB’s etc. FPGA/Micro Controller /BGA other SMD Custom-made components and through hole components.The above type of PCB’s are designed as multi-layer PCB comprises of 2 to 32 layers.Layout experience on High speed interfaces like Intel Boards, SDRAM, DDR3, PCI, PCI Express, Difference projects.GBR creation, drilling details and sending it to PCB manufacturer for further process, panel making. Releasing different files like ODB++, IPC-D-356/A, LPL, BOM, PKM, MFL, ABA, LFR, BDF, IDF etc.Exposure in various IPC PCB design standards (IPC 2222, IPC 2221, IPC 2152 etc), DFT, DFM, DFA, ICT guidelines & SI.