Worked 12+ Years as a High Speed PCB Design Engineer with proven experience upto 10 Layer, Impedancecontrolled, EMI constrained PCB design in RF, Audio, and High Power Domain.Have experience with Processor implementation with BGA and LGA Package. Sound knowledge in PCIe, LAN, 4G, eSIM, LNA Amplifier and Ballon Network. Done 1000+ Fan outs in a 12+ Year career, 5000+ PCB designs that went into more than 1000+ Production chains. Fair knowledge about buried, blind vias along with production and manufacturing experience.Skills● Design Skill: Thermal Compensation in High Power Domain (more than 10A+), RF routing on 50 Ohmsimpedance chain on single ended and striped PCBs in ROGER boards.● Tools Expertise: Eagle CAD, KiCAD, ALTIUM, PSPICE, TINA-TI, TOOLKIT V4, PROTEUS● Software Skills: C Programming in Visual Code studio, Arduino IDE, STM32 IDE for hardware testing.● Architecture Skill: Layer Architecting up to 10 Layers, Fencing and Thermal Via Compensating, PCIerouting architecture, Camera and Video Protocol Architecture, Fan Out architecture for 644, 1028 and otherhighly dense microprocessors.● Design Experience: nVIDIA Jetson, Rockchip RK3588, RK3568, NXP, ARM, STM32, Intel Z series,Quacktel, Mediatek, Snapdragon based design● Communication Protocol Expertise: UART, I2C, SPI, DDR, MIPI, PCIe, USB C, TCP/IP, Ethernet, WiFi,Bluetooth, Zigbee, I2S, SIM card (micro, mini, esim)