• Overall HW development responsibility of Keyssa 60GHz high speed (USB SS, DP, PCIe) wireless connectors. Leading a multidisciplinary team of EM, HW, EE, Mech., Material, Packaging, Layout, Regulatory and Test engineers to develop, implement and test Keyssa solutions.• Wide responsibility from defining 60GHz EM solution all the way to write DVT test SW in C++.• Directly work with customers to successfully implement Keyssa solution into their latest products

• Designing SIP (System In a Package) with WLAN 802.11ac and BT for Samsung Galaxy S5 LTEa. Design, bringup and platform integration of SIP in close collaboration with Samsung.• Design of first 4x4, 802.11ac MU-MIMO wave 2 router platform with high power PA. Overall responsibility for the HW development. Responsible for schematic and board design, bringup and tuning of HW as well as HW related algorithm all the way to production including customer platform on-site support and regulatory… Show more • Designing SIP (System In a Package) with WLAN 802.11ac and BT for Samsung Galaxy S5 LTEa. Design, bringup and platform integration of SIP in close collaboration with Samsung.• Design of first 4x4, 802.11ac MU-MIMO wave 2 router platform with high power PA. Overall responsibility for the HW development. Responsible for schematic and board design, bringup and tuning of HW as well as HW related algorithm all the way to production including customer platform on-site support and regulatory approval. Show less

Responsible for the hardware board design of industrial leading WLAN 802.11 a/b/g/n/ac modulesInterface with customers to deliver customized WLAN solutions all the way to mass prodcutionWork with vendors to develop customized solutions for our WLAN modulesWork with contract manufacturers overseas to manufacture and test module and release to high volume productionLeading and building a successful team of RF engineers

Design and development of 802.11 a/b/g/n/ac modules and release to high volume productionDevelopment of front end architecture, schematic capture, layout design, fab, bringup and characterization of reference as well as customer specific boardsResponsible to meet customer specification and worldwide regulatory approval

design and development of 802.11 a/b/g/n WLAN reference and customer modulesdeveloped thermal mitigation strategies on PCB leveldeveloped EMI reduction solution on PCB level

Design and implementation of a 900MHz sub-sampling wireless MIMO 2x2 testbedRF hardware counseling

Design of customer specific, analog ASICTransistor level cuircuit development, simulation, ASIC layout, ASIC fab and lab bringup on PCB

Teaching undergraduate students in microelectronics (Bipolar and MOS transistors)Supervising undergraduate students on their Bachelor of Science thesis