Leading the SoC (System on Chip) & Mixed Signal Design group in Zürich.

Co-founder, Member of the Board and R&D Manager.Innodul focuses on the development of high-speed POF (Plastic Optical Fiber) communication systems and on the development of integrated circuits (ASIC).- Relation with investors, external partners and customers- Project Leader- System Architect: customer requirements, product specification, architecture definition- Technical activities: OFDM, DSP, C++, embedded software, Matlab, PCB design, VHDL, analog and digital… Show more Co-founder, Member of the Board and R&D Manager.Innodul focuses on the development of high-speed POF (Plastic Optical Fiber) communication systems and on the development of integrated circuits (ASIC).- Relation with investors, external partners and customers- Project Leader- System Architect: customer requirements, product specification, architecture definition- Technical activities: OFDM, DSP, C++, embedded software, Matlab, PCB design, VHDL, analog and digital simulation, metrology, Ethernet, Optical communication, ...- Product development, evaluation and certification: optical transceivers, Gigabit Ethernet switches, ... Show less

Leading the System Group with teams in Germany, Switzerland and Israel: responsible for product definition, chip specification and applications for Cordless and IP Terminals.Program Manager for DECT chips (cordless telephony).

Leading the System Group (product definition, specification, applications) and the Customer Support Group.Program Manager for DECT chips (cordless telephony).The whole Business Line was acquired by DSPG in September 2007.

Development of integrated circuits for high-speed telecom applications (IP, SONET, ATM, E1, T1, HDLC, ...)Project leader of international projects with teams in India, USA, France, Switzerland, ...

Development engineer and project leader for Integrated Circuits in the following fields: Microcontrollers, Cordless phones, Digital Telephone Answering Machines (DTAM)