Transfer Student in Computer Engineering at Iowa State Universityhttp://www.ece.iastate.edu/ Dean’s List - Spring 2014, Fall 2016, Spring 2017 Engineering Department Student Ambassador - Fall 2014, Spring 2015, Fall 2015Graduated May 2017 (GPA 3.49)

Provided troubleshooting, repair, calibration, failure analysis, and occasional customer support for PIC 18F4550 based power measurement devices used in HW/SW development of mobile devices. Processed batches of post-production unit test failures for failure analysis, identifying failure modes such as pcb defect, assembly issues (shorts due to excess solder, improper mounting orientation, missing or incorrect mounted parts), or part contamination issues (wrong value or part variation).Repaired, reflashed bootloader/firmware using Microchip MPLab as required, and calibrated units for return to service. Provided failure analysis reports to the manufacturer as process feedback. Addressed technical customer questions as needed.Quickly identified a part contamination issue which resulted in a 50% unit test failure rate and had brought production to a halt. Provided feedback on assembly and PCB issues that allowed the manufacturer to address issues early and maintain a consistently high post-production testing pass rate.

Worked as part of the Electrical Controls group at UL Newton in support of a wide variety of customer engineering projects to include pcb design, industrial control systems fabrication, wiring harness fabrication, and technical support for various testing fixtures used by UL Lighting Test Equipment services.Used OrCad for schematic entry and layout of 2-layer PCBs such as a 3-channel photocell amplifier, wiring control interfaces, and a relay control board to support custom testing routines for appliances. Reverse-engineered multi-layer PCBs to produce OrCad schematics.Fabricated wiring harnesses and test fixtures, soldered and tested PCBs, managed lab and test equipment for the Electrical Controls Group. Managed bill of materials (BoM) and parts procurement for projects. Provided support in the development of a Type 2 Goniophotometer used for measuring characteristics of industrial light fixtures. Handled procurement, installation, and wiring of electrical components on a prototype system. Created documentation detailing the construction of wiring harnesses and assemblies for the manufacturing department. Coordinated with the Northbrook, Illinois UL testing facility to set up Goniophotometer CE certification, running the unit through a battery of electrical immunity and radiation tests. Worked with the testing staff to address deficiencies and come up with on-the-spot modifications to obtain CE certification. Provided troubleshooting, repair, and upgrade support for internal and external customers.

Worked in the Display Engineering department maintaining the VLSI lab and supporting research and development of pico-projector LED engines and FLCOS display panels.Troubleshot, repair and perform functional verification tests on video driver boards, LED driver boards, and associated hardware. Perform FPGA, EDID/System PROMs, and microcontroller firmware/software updates.Performed soldering on fine pitch components and connectors to 0.5 mm pitch. Use hot air to remove and replace QFN parts. Fabricate cable assemblies and test harnesses using various crimps and connectors.Organized and stocked the VLSI lab with tools, test equipment and critical parts and supplies to support ongoing R&D on display panels and supporting hardware.Helped resolve a long-standing power glitch problem on display panel test boards and implemented a rework, resulting in more streamlined and stable display panel testing. Resolved a grounding problem that was causing loss of video synch on customer-bound development boards. Discovered a part contamination issue with the Japanese supplier that shut down development of FLCOS displays pending resolution.

Worked on contract in a student lab assisting Masters and PHD Engineering students with power electronics related projects sponsored by various corporations. Assisted students with mechanical packaging of prototypes.Worked with a student team to complete eight prototype bi-directional intelligent power conversion modules for InScope International within the project timeline. Designed and fabricated mechanical packaging for power units and hand soldered 16 fine pitch boards with 100% yield. Managed BoMs, parts inventory, and ECOs for the project.Maintained cleanliness and organization of lab, order lab supplies and equipment, prepare monthly expense reports and allocations.

Worked in an ISO 9001 production environment troubleshooting and repairing high-voltage RF generators used in thin film and semiconductor manufacturing to component level.Utilized automated Labview/Matlab test stations to verify unit conformance to specifications through unit, HASS, burn-in, CE conformance, and final testing.Identified automated test failures or marginal units and troubleshoot to component level using schematics and a variety of test equipment such as frequency counters, function generators, oscilloscope, power meters, and network analyzers.Made recommendations to Test Engineering for changes in the testing of RF load configurations to improve complex load accuracy which resulted in procedural changes.

Worked as a Junior Hardware Engineer on a Smartphone Hardware Development team. The team collaborated with major mobile phone manufacturers to build development boards for new chipsets and driver development for peripheral hardware for driver development.Performed bring-up and functional verification of all hardware, correcting any issues and applying ECOs as needed. Handled part procurement and worked with layout and assembly facilities to mitigate schedule delays.Developed and designed an I2C expansion board using OrCad Design Entry The board consisted of FM radio, QWERTY keyboard, accelerometer, and temperature, pressure, and proximity sensors. Worked with layout and PCB fabrication houses to finalize the design. Board bring-up was successful and the board was distributed to software developers to be used as an add-on to mobile devices for driver development.

Worked on contract and full-time at Microsoft on a Smartphone Hardware Development team producing form-factor prototype phones, primarily based on TI’s OMAP microprocessor, for driver and software development.Assisted engineers in troubleshooting and identifying hardware bugs as well as performing informal validation on prototype devices utilizing a variety of test equipment such as Logic Analyzers, Digital Oscilloscopes, Function Generators, Frequency Counters, Protocol Analyzers (GSM/CDMA).Worked closely with Engineers and Program Managers to ensure timely production of reference designs and prototype devices for internal driver and software development.Supported Design Engineers with schematic and symbol creation in OrCad Design Entry CIS.Documented, applied modifications, and tracked ECOs for prototype devices.Responsible for failure analysis and recommending design or process improvements based on investigation results.Performed surface mount (0201) and through-hole soldering of manufactured and prototype boardsMaintained, troubleshot, and repaired a wide variety of mobile devices to board/component level.Performed power measurement testing and analysis on mobile devices.Maintained and updated a Great Plains parts database and associated parts room with over 8,000 electronic, mechanical, and electro-mechanical parts.Coordinated with Program Manager to ensure all electronic parts were in house for assembly by project deadlines.Worked closely with an electronics assembly facility to ensure all parts are delivered on schedule for board production and coordinate any post-production modifications.Ordered and maintained tools, test equipment, and supplies for a hardware engineering lab.

Maintained, troubleshot, and repaired to component level remote robotic pipeline video inspection cameras, robotic crawlers, and associated equipment used in pipeline inspection vehicles.Maintained, troubleshot, and repaired, to component level, gas monitors (CO2, CH4, O2, H2S), thermocouple boxes, and temperature script charts.Installed, maintained, and repaired to component level 150 MHz vehicular 2-way radios, power amplifiers and antennas.Installed AM/FM radios, speakers, and antennas in company vehicles.Purchased, maintained, troubleshot, and repaired company PCs.Purchased, installed, and configured a Dell 1300 Poweredge server with Win2000 as an application server to support proprietary maintenance software and database.Installed and configured a peer-to-peer network for the maintenance department.Supervised and advised in the company’s Y2K compliance effort.Assisted in administration of the Rolm 9200 CBX and voicemail system.Developed documentation and calibration procedures for the company’s successful ISO 9001 certification effort.

Supervised a communications electronics facility consisting of Teletype/Facsimile, telephone/switchboard, and HF/VHF tactical radio repair.Worked with a technical control facility to maintain over 50 critical secure voice and data telecommunication networks in a NATO communications facility.Maintained control measures for top-secret cryptographic equipment and variables.Troubleshot, maintained, and repaired to component level teletype, DTE, voice and data cryptographic equipment, modems, line amps, etc.Maintained, troubleshot, and repaired to component level radio-teletype equipment in support of secure communications centers and mobile tactical field communications.Received Army Good Conduct Medal (3), Army Service Ribbon, Overseas Service Ribbon, Army Achievement Medal (2 Oak Leaf Clusters), Army Commendation Medal, Joint Service Commendation Medal, Non-commissioned Officer Professional Development Ribbon (2).Rose to rank of Staff Sergeant/Platoon Sergeant.Received honorable discharge.