Steve Raphael Email & Phone Number

Cambridge, United Kingdom

Head of planning for all of Intel’s Mobile Wireless Platforms including affordable and high-end product lines. Reporting to the Client Computing Group’s VP of Architecture and Planning.Leading a global team of ten senior mobile wireless product managers and with responsibility for the planning of Intel’s mobile wireless roadmap, roadmap process and the management of the resulting portfolio of products including Application Processors and cellular modem-integrated SoC platforms. Planning Scope: Portfolio gap analysis, up-front definition of products including requirement setting, customer interactions/presentations and driving the products through the early lifecycle phases, technology scouting, competitive analysis, business-case creation, trade-off discussions with RD, partner management and frequent presentations to senior management.

Munich Area, Germany

Head of chipset platform planning for Intel’s line of affordable mobile wireless products.Quickly built a team of five senior mobile wireless product managers to plan and manage Intel's modem-integrated (3G, LTE and LTE-A) line of Affordable Phone and Tablet chipset platforms, two of which are now in volume production with a number of phone, tablet and IoT/IoE/M2M customers. Planned and product-managed the 1st and 2nd generation of Intel’s LTE SoC’s. Preparation of product proposals for 3rd generation and numerous other products and derivatives.

Munich Area, Germany

Responsible for the planning and marketing of highly integrated phone chipset platforms.On joining Intel Mobile Communications, initial responsibility was for the planning and marketing of Intel’s highly successful, multi-million unit per month feature-phone platforms. Successfully defined and launched three platforms (XMM2230, 2250, 2100) plus derivatives together with the three phone market leaders. Frequent customer presentations and commercial negotiations.At the beginning of 2013 got the task to lead the definition of Intel’s 1st Android LTE-A smartphone chipset platform. Interacted with many network operators, customers, IP providers (GFX, Video) and internal RD in order to define the modem feature-set, RF Band Combinations, Application Processor features. Analysed the market, competitive landscape and prepared the business case for the product.

Copenhagen Area, Denmark

Working in the newly established Mobile Phones R+D Chipsets organization and following a move to Nokia’s Copenhagen R+D centre, directed Nokia’s technical engagement with two tier-one cellular chipset semiconductor partners (Infineon and Broadcom). Definition of architectural and technical specifications of key 2G (including the still-shipping XMM1100) and 3G cellular chipset platforms. Driving of the longer term technology and IP-block discussions with the central R+D units of the semiconductor partners. Commercial/Budgetary discussions..

Farnborough, Uk

Chief architect reporting directly to the head of Nokia’s 130 person Complementary Wireless Solutions group (technologies included WLAN, Bluetooth, GPS, FM radio, Digital Broadcast Receivers, NFC, UWB, WiMAX), responsible for Nokia’s CWS strategy and technology management of industry partners.Key accomplishments include: Shaped the mobile connectivity landscape and portfolios of industry leaders TI, CSR, Broadcom and ST Ericsson with combo strategy, for example ‘WiFi+Bluetooth+FM combo’. Led WiMAX provider benchmarking activity. Specified requirements for NFC transceivers. ‘GPS Device’ US patent 7486231 granted.

Farnborough, Uk

System Integration lead for Nokia’s proprietary 2G Tiku-Edge baseband smartphone chipset platform. Responsible for specification of emulation plan using Quickturn Virtual Prototype.

System design responsible in Nokia’s 2nd Symbian based camera smartphone program. Specified a camera interface ASIC including image signal processing unit and embedded DRAM with an industry partner. Gained significant knowledge about imaging and CMOS sensors.

System integration responsibility for Japanese cellular (PDC) configuration of Nokia’s 4th generation digital BB chipset plus new RF architecture utilizing a joint detection receiver.

System designer working in Nokia’s Advanced Development Unit on the specification of Nokia’s hugely successful 4th gen mobile ‘UPP’ chipset platform. Key contributor to the partnership with STMicro on the ‘UEM’ power supply, RF-Interface and audio ASIC. Architected, designed and project-managed a discrete prototype board of the UEM ASIC using FPGA, DAC’s, PLL’s, voltage regulators and high-order filters. Skills Acquired: Fiter simulation, VHDL programming (attended course) and use of FPGA development environment, ‘C’ programming (attended course).

Tokyo, Japan

Secondment to Tokyo to act as front line R+D engineer during phone launch and initial sales period. Reporting to R+D project manager in the UK. Skills acquired: Understanding of RF transceiver and RF Front-End electronics and systems.

HW design engineer working on a mobile phone program for the Japanese market, reporting to the program chief engineer. Responsible for audio and power management circuitry, including specification of a partner (STMicro) power ASIC.

Andover, Hampshire, Uk

Sole responsibility for the design of the control processor electronics and software used in Stannah’s elevators. Expertise in the following SW languages acquired: 6502 Assembler, Forth