Responsible for the design and packaging of all OEM custom assemblies for Semiconductor processing equipment. Interfaced with customers for new design requirements and concepts to ensure a product that is cost effective and fit within the customer's space constraints. Created conceptual layouts from rough sketches and verbal inputs to verify form fit and function of the required assemblies using MDT 6.0 and Inventor 10 3D software. Procured all materials to quickly assemble and deliver first prototypes to customers per their required dates. Visited various manufacturing facilities to ensure all designs and proposed concepts will be manufacturable and cost effective.

Design mechanical and electrical packages for semiconductor processing equipment. Part of the New Product Development team assigned to System AC, Main AC, Generator rack, and Operator interface panel for the 300mm product development group. All packages include enclosures, wiring harnesses, safety covers, electrical bulkheads, and safety interlock mechanisms. Worked closely with Manufacturing to design and develop assembly and test fixtures. Performed tolerance analysis for fit and function of all work assigned upon completion. Applied Geometric Tolerancing to all applicable fabrication drawings for all precision parts. Attended and performed presentations of all work in design reviews for concept feasibilities. Also generated preliminary bill of materials and assembly drawings for ECO release. All design and layouts generated on PE Solid Designer and detail fabrication drawings created via AutoCad R14 or HP ME-10 in accordance with APPLIED MATERIALS' and ANSI Y14. 5M-1982 standards.