Steve Alagna Email & Phone Number

Austin, TX, US

Austin, Texas, United States

Steve Alagna is a seasoned Packaging Engineering leader with over 35 years of industry experience on both the supply and end-user sides. At Dell, he leads packaging sustainability setting and driving strategy for all packaging initiatives, ensuring packaging solutions exceed customer expectations, are environmentally friendly and innovative. Steve’s.

Little Rock, Arkansas Area

• Consultant in the Supply Chain Group to the Motor Grader Division focused on identifying and implementing cost reduction opportunities, process and operational improvements, and driving environmental initiatives.
• Identified and implementing over $135,000 per year in cost savings by performing plant audits, financial validation, and successful client presentations.
• Achieved Six Sigma Lean Manufacturing Green Belt Certification.
• Collaboration and development of a Return on Investment financial analysis tool, utilized to validate supply chain cost reduction opportunities in packaging, transportation, and manufacturing.
• Eliminating 233,000 lbs. of waste by leading and implementing multiple returnable packaging programs.
• Developed reports in SAP and freight cost tools to complete return on investment analyses.

• Recruited by Unisource Senior Executives during Intel tenor to create and lead an engineering solutions group within parent Unisource Worldwide. Independently established the strategic direction, defined the vision and.
• Achieved material-neutral engineered solutions through recruiting, training, and mentoring of engineers, and drove the implementation of rapid prototyping of those solutions.
• Utilized influence and networking skills to transform a product development team from a support service to a globally recognized brand.
• Successfully built and awarded ISTA certification, 2 multi-million dollar world class test labs to perform package, material, and product testing, along with recruiting and training of test engineers.
• Created excitement in the marketplace surrounding new brand and positioning which resulted in 50% year-over-year growth rate in customer opportunities.
• Developed marketing strategies resulting in 2013 900% revenue growth.

Dupont, WA

• 13+ Years as Program Manager and Senior Engineer with the Global Leader in Semiconductor Manufacturing.
• Leader of global cross-functional teams through the Product Life Cycle on retail packaging programs from exploration to decommission, implementing improved environmental designs and reducing costs, improved processes.
• Designed, implemented, and brought to market retail packaging for processors and desktop printed circuit boards supporting multiple global programs, spread across multiple product development sites, and 4 separate.
• Performed all global NPI and sustaining product package engineering including design, test, specification and engineering drawing generation, bill of material and engineering change order management, commodity and.
• Performed server system and server printed circuit board unpackaged shock and vibration, root caused issues and solved problems with mechanical teams to deliver solutions as well as developed an improved unpackaged.

Boise, Idaho Area

• 4 Years as Packaging Engineer with a Global Leader in Technology and Computing Products.
• Performed product retail and bulk package engineering and ensured procurement activities met the division’ goals for cost, manufacturability, quality, delivery, market effectiveness, automation, and environmental.
• Supported 5 distribution centers including East and West North America, the Netherlands, France, and Singapore ensuring packaging effectively meets the needs of the manufacturing lines, warehousing, and shipment to the.
• Designed, tested, and documented packaging components for retail products, ensuring their ability to protect a product, and meet requirements of the client, schedule, cost, and the environment.

Kent, WA

Hyannis, MA

Keller, TX

Micro Mba, Business Administration And Management, General

Bachelor Of Science, Packaging Engineering