Steve Dick Email & Phone Number

Lexington, Ma, Us

• Supported AEHF satellite payload and ground terminal test emulators in the lab and at field sites• Used spectrum analyzer to measure and analyze frequencies from 10 MHz to 44 GHz• Provided field support and system maintenance of AEHF test payloads at defense contractors development and manufacturing sites• Lead the upgrade, refurbishment, and re-verification of AEHF test payload systems returned from the field to be sent back out to a different field site• Tested subsystems and digital boards for field spares and evaluated returned subsystems from field

Redmond, Washington, Us

• Supported design verification of unreleased product in a new market line for Surface• Tested subsystems, and logged bugs, involving I2C, SPI, clocks/crystals, USB 3.1 Gen 1 Transmitter and Receiver Electrical Compliance Tests, USB PD 2.0 Communication Engine Compliance Tests, DisplayPort 1.2b Compliance Tests, DisplayPort over Type-C, TDR of differential pair and single-ended bare board traces, xHCI Interoperability Testing

Redmond, Washington, Us

• Supported design verification of next generation Xbox controller along with a proprietary USB 3.1 Gen 1 device for developers of Xbox games• Tested hardware and firmware at system and subsystem levels involving power integrity, buttons, half H-bridge motor drivers, USB overvoltage/overcurrent protection, USB 3.1 Gen 1 Transmitter and USB 2.0 High- and Full-Speed Electrical Compliance Tests

Redmond, Washington, Us

• Supported RF and design engineers with testing (frequencies up to 2.45 GHz), debugging, building mechanical and electrical prototypes/fixtures and rework soldering of RF circuitry• Wrote engineering reports analyzing experimental mechanical and electrical tests, utilizing Excel to graphically display results of multiple data sets• Performed evaluation testing on switch-mode power supplies from various manufactures in order to aid in determining optimal regulator for next revisions/future designs

Redmond, Washington, Us

• Supported from proof-of-concept to mass production design verification of the Type Covers for Surface Pro 2 and 3, and Bluetooth Low Energy (Smart) Pen for Surface Book• Tested hardware and firmware at system and subsystem levels involving system bring-up, clocks, power integrity, FSR, proximity, UART/I2C/USB buses, keyboard, backlighting, haptics, capacitive touch sensing trackpads, accelerometers• Performed evaluation testing on switch-mode and LDO power supplies involving efficiency, output ripple, transient response, line and load regulation, and turn-on time parameters analyzing different inductor selections• Created protocols relating to hardware/software verification based on defined and undefined product specifications• Used Beagle I2C/UART/USB analyzers, spectrum analyzer and TDR to assist in solving design problems at the system and component level, such as impedance measurements of tip portion of smart pen to investigate user perceivable digital ink latency issue on touch screen• Logged and regressed bugs and provided input into root cause, such as incorrect enabling of circuits, timing and latency issues, power draw improvements that lead to longer battery life• Reworked PCBs as needed for testing and evaluating with SMD components down to 0201

Cedar Park, Tx, Us

• Performed incoming evaluations and general troubleshooting on MWD tools sent in for repair as well as in-house tools• Efficiently and effectively carried out root cause failure analysis of SDUs, MCUs, TPSs, RFDs, Pulser and Directional modules down to the component (chip) level, such as failed capacitors and ICs• Interfaced with R&D regarding issues that arose while troubleshooting systems and components in order to assist in improving the reliability and quality of the products, such as replacing each tantalum capacitor with a bank of ceramic capacitors in an effort to reduce high ambient temperature failures

Toronto, Ontario, Ca

• Test Engineering support for functional testing of PCBs including debugging and determining root cause of failures at the component level, such as cold solder joints and incorrect orientation of ICs, of production boards for various customers• Created pivot tables in Excel summarizing and analyzing test data of production PCBs• Wrote and implemented protocols for functional tests of new customer products to be used by technicians and operators to validate production boards• Trained and delegated up to 12 technicians and operators on procedures and test equipment for functional testing of new customer PCBs along with interfacing directly with customers during factory visits to ensure product quality and testing procedures were maintained

Skaneateles Falls, New York, Us

• Played integral role on Medical R&D Verification and Validation team• Wrote, implemented and tested verification and validation protocols per ANSI/AAMI SP10 and EN 60601-1 for production equivalent non-invasive blood pressure modules for national clinical trials• Bench and chamber tested electrically, mechanically, and environmentally non-invasive blood pressure, temperature and SpO2 modules for design and safety issues, including but not limited to ESD, accuracy and single fault tolerance, resulting in design enhancements that increased safety for patient and user• Supervised staff of up to eight cooperative interns, reviewing their protocols and test reports for errors and assigning tests to interns during situations involving strict deadlines• Performed EMC radiated RF emissions/immunity per IEC 61000-4-3 for temperature/blood pressure modules• Carried out USB 2.0 Full-Speed Electrical Compliance Testing for temperature and SpO2 modules• Completed applied testing trials for blood pressure modules in six weeks rather than typical eight weeks, meeting tight deadline• Prototyped drip test fixture per IEC 60529 for IPX1 for repeatable in-house use, saving company from outsourcing initial testing to testing lab • Performed in-rush and FET switching current measurements for blood pressure module in order to verify current consumption requirements per USB 2.0 Full-Speed Electrical Compliance specification

Eden Prairie, Mn, Us

• Developed USB-to-Serial converter with additional audio circuitry, which factored into Benson Medical being awarded 10-year, multimillion-dollar Department of Defense audiometer contract • Eliminated digital noise in audiometer system by separating analog and digital grounds, resulting in enhanced clarity in headsets for use by patients• Spearheaded initial design of embedded 8-bit, 16 MHz C251 Atmel microcontroller board for stand-alone audiometer slated for new market line• Devised and implemented diagnostic programs in C for embedded microcontroller board used in manufacturing, thereby streamlining verification processes and reducing assembly time for final product• Troubleshot released USB-to-Serial converters and audiometers to debug and resolve issues related to noise and robustness, thereby improving product quality, performance, and reliability• Participated in development of documentation for use by manufacturing personnel in programming and assembly of products