Steven Baum Email & Phone Number

Basking Ridge, Nj, Us

Supply Chain Risk Management: Head of Verizon’s Global Supply Chain Risk and Resilience Management program. Responsible for direct and indirect engagement with suppliers to ensure continuity of supply. Managed development of a Multi-Tier Intelligence platform to illuminate Verizon’s supply chain landscape and to identify sources of risk. Areas of focus: continuity of supply (both finished goods and components), compliance, privacy/security, reputation, human rights, environmental impact. Co-Leader, ATIS/Department of Defense (DoD) 5G Supply Chain Working Group. Member, Department of Homeland Security (DHS) ICT Supply Chain Task Force. Steering Committee Member, TIA Supply Chain Security Working Group. Member, Semiconductors in America Coalition (SIAC). Supply Chain Quality: Developed methods for Big Data analyses to illuminate causes for customer complaints and to automate responses in order to prevent trouble tickets. Developed models for predicting expected trouble ticket volumes. Developed models for inventory movement tracking and shrinkage.Managed a team of technical experts with responsibility for understanding and improving the performance of Customer Premise Equipment (CPE) that supports Verizon Fios services. Performed root cause analyses on defective returns. Drove accountability with OEMs on component and production failures. Worked with contract manufacturing partners and OEMs to ensure high quality product and correct performance. Audited manufacturing partners’ production lines (largely in mainland China and in Taiwan) for compliance with agreed-upon standards. Established Reverse-Logistics testing parameters and specifications.

Santa Clara, California, Us

Technical Program Lead: Managed technical aspects of team that developed and integrated a MEMS-Based Solid Oxide Fuel Cell (SOFC) into a high volume manufacturing line. Acted as an Intel foundry representative to the customer; negotiated technical requirements, timelines, documentation, and priorities. Responsible for certification and problem resolution for all products in the SOFC product line. Developed Change Control, New Product Introduction, and Excursion Containment methods for Fab 17 foundry organization. Customer Quality Engineer for SOFC products.Program Manager: Responsible for 8 Level Metal Pentium 4 Extreme Edition Program. Drove all aspects of program to deliver industry-leading microprocessor performance. Worked closely with factory, design, layout, quality/reliability, and Intel product divisions to ensure timely launch of product. Addressed all performance, process, quality, and reliability issues related to this program. Backend Integration Engineer: Led team of process engineers responsible for interconnect health and improvements for 130nm CMOS production line. Led multi-factory Change Control organization. Responsible for ongoing analysis (commonalities, inflection points, parametric trends/shifts) and proactive/reactive action plans to address quality and reliability issues. Addressed customer-detected quality issues via analysis of data and leading investigations of possible factory-related causes. Development and Path Finding: Responsible for developing a program to eliminate lead from Intel 200mm products to comply with European Union ecological directive. Led teams that explored and developed various process modules in support of new business opportunities.

Houston, Texas, Us

Backend Etch Team Leader: Led team that selected production plasma etch equipment for 0.35um semiconductor manufacturing processes. Developed and sustained metal and oxide plasma etch processes to enable the production of the Alpha microprocessor and Digital's suite of support products. Managed a staff of etch process engineers and technicians. Worked with suppliers and the Sematech consortium to improve equipment performance and reliability.

Wilmington, Ma, Us

Lithography and Etch Process Engineer: Developed and sustained etch and microlithography manufacturing processes in support of the production of CMOS, BiCMOS and Complementary Bipolar signal processing products. Developed lithography and etch processes in support of the production of a monolithic, surface micro-machined accelerometer chip. Fab integration owner for the ADXL accelerometer product. Worked with chemical and equipment suppliers to improve performance of products.

Master Of Engineering, Applied And Engineering Physics

B.S., Applied And Engineering Physics