Contractor

Directed layouts designed by Bedford's group, and reviewed other groups' layouts. Analyzed processes, and developed test structures for new and existing processes. Counseled in formulation of best layout practices, showing importance of vertical metallization in reduction of resistance and increase of current capabilities.

Consulting engineering firm to other semiconductor companies (Motorola, Tyco, IMP, and other companies).Held responsibility for all layout designs by company's engineers as well as processes.

Oversaw standard, full-custom layout of BICMOS DABIC1-5 multi-voltage, facilitating development of processes. Trained junior layout engineers and designers. Interfaced with other sites, such; as well as process, CAD service, mask shop, and marketing groups. Built chips for disc drivers, ABS sensors, cam/crank sensors, Zero Speed, and direction/position hall effect sensors. Advised in Breed air bag and other chips, as well as failure analysis of chips.

Spearheaded layouts of standard cell and full custom chips needed for mass storage group, such as disc drivers and clock drivers, along with package design. Wrote DRC checking program in Dracula, and advised composition of LVS checker used by VTC. Utilized VTC as foundry with deep trench, oxide-washed emitter process.

Ran full custom, semi-custom and gate array layouts, as well as development using multi-voltage BIPOLOR processes for automotive and camera markets. Led in-house product packaging and equipment maintenance.

Held responsibility for equipment set-ups and management of up to 43 personnel.

Held responsibility for torpedo weapon system, and acted

Served as a production worker, running various pieces of equipment and performing set-ups.

Maintained shelving stock, yard work, and waited on customers.