Steven Proctor Email and Phone Number

Joined design and development team when strategic product line was suffer from 10% yield and took it to >60% in less than six months through process knowledge and standardization.Advanced company's product line development with evaluation of future materials with temperature stability testing and analysis.Evaluated new designs with FMEA Six Sigma tool and MatLab models to model sensor performance.

o Employed Six Sigma tools to improve production and reduce scrap: • Reduced sensor test failures from 2.5% to 0.5% and achieved $120k annual scrap savings. • Applied unique process knowledge to double the sensor strength; reducing failure rates. • Tiger Team protecting $100M Guidance System business. Rapid response team member driving resolution of sensor non-linearity. Immediately implemented screening process containment; quickly identified root cause and restored production line feeding $100M guidance system business. Partnered with supplier to implement corrective action of manufacturing controls.o Created visual work instructions, overcoming language barriers and assuring assembly operator understanding and conformity, reducing process variation.o Analyzed Resonating Beam Accelerometer (RBA) performance and yield metrics and implemented rapid response to line issues; preserved production volumes.

o Evaluated dimensional accuracy of deliverable parts with CNC based Mycrona metrology system while dramatically reducing touch time by 66% through alignment step reduction.o Analyzed production samples on Zeiss SEM/EDX and set up epitaxial Si thickness SPC process.o Maintained bonding and dicing process while developing customer specific processes for Honeywell MEMS Services business.o Recognized with nine technical achievement and process development awards for contributions to Honeywell.

o Spearheaded automated wafer mount and dicing systems acquisition, and managed growth of dicing operations for medical analysis product from prototype delivery to $10M/year sales. o Established wafer level bonding techniques utilizing anodic, fusion, and frit methods. Quickly founded standard bonding practices that reduced complexity and simplified operations of accelerometer and gyroscope manufacturing. o Successfully completed Six Sigma training and Green Belt certification including process mapping, FMEA, DOE and MSE.

o Instrumental team member in the development of a modular interlocking construction toy for assembling N-scale landscapes and urban environments. Designed and modeled pieces and connection systems for every element of toy from substrate to architecture in SolidWorks. o Reviewed and corrected patent filings as technical liaison to patent attorney and subcontracted engineering firm. Through company collaboration, now hold co-inventor title on six patents.