Steve Peters Email & Phone Number

Durham, Nc, Us

Lowell, Ma, Us

Develop new products using GaN-SiC, GaN-Si, and legacy RF technologies. Serving markets including Telecom, A&D, and Multi-Market

Lowell, Ma, Us

Developing power RF GaN on Si products

Neubiberg, München, De

Program Management leader for IC development•Managed development projects for many families of digital multiphase and POL IC products for VR applications for high performance CPUs, memory, and graphics processors. Oversaw development projects for digital control ICs for motor control applications. •Led the integration of the newly acquired CHiL Semiconductor Corporation based in Tewksbury, MA that had been purchased for $75 Million by International Rectifier (IR). •Selected and implemented an effort-based program management system utilizing timesheet input for all IC product development resources, enabling detailed project budgeting and tracking, resulting in improved global resource management and utilization across business units. Substantially improved ROI measurement at the project level. • Played a lead role in the development and evolution of NPI business processes

Neubiberg, München, De

•Released more than 50 new IC & multi-chip products•Led the development effort of the SupIRbuck family of voltage regulators, which utilize co-packaged control Integrated Circuits (ICs) with power MOSFET transistors.

•Set up and staffed back-end operations, including all testing and assembly from wafer to final product. •Implemented a basic quality system and tools for evaluating material in support of final product development.•Developed capital plans and investment analyses for manufacturing ramp-up. Created a comprehensive reliability test program to demonstrate the reliability of this first of kind of technology.Responsibilities ➢Participated in business plan development for fund raising, including market analysis, development of an operations plan, and the development of a front/back operations model used to generate pro-forma financial statements. Demonstrated knowledge and skill in leading and directing project teams and in delivering project results within the constraints of scheduling, budgets and resources. Managed key customer programs less P&L responsibility.

Achievements• Selected and implemented an Enterprise Resource Planning software package.Managed implementation team, mapping all business processes, re-engineering where necessary to take advantage of system capability. Implemented the entire system on time (5 months) and within budget, with minimal outside consulting.Responsibilities ➢ Participated on management team. Was responsible for the day-to-day operations of the organization that developed and manufactured magnetostrictive position sensing devices. Managed costs and productivity as to meet the financial goals of the company.➢ Managed processes, manpower, and materials to meet customer demand for a more comprehensive suite of standard / custom products.➢ Supported the product roadmap through the development and introduction of new products to manufacturing.

Achievements• Designed and implemented manufacturing processes. Developed and implemented test solutions for products / subassemblies.• Managed and continuously improved manufacturing yields. Maximized cost performance of all manufactured products.• Maximized product quality and minimize warranty claims. Promoted a Six Sigma model approach to manufacturing.• Implemented a product testing strategy that emphasized defect elimination at the subassembly level.• Reduced defect rates by half on the two highest volume product lines. Identified and corrected many product quality issues, which ultimately contributed to a reduction of product warranty return rates, which exceed predetermined organizational goals.Responsibilities ➢Managed a staff of 15 engineers and technicians to develop, implement, and maintain processes for the manufacture of magnetostrictive displacement and liquid level transducers. ➢Identified and led new technology projects that would improve operational efficiency, costs and quality and set standards for global use

Koto-Ku, Toyosu, Tokyo, Jp

Achievements• Implemented a project management system to more effectively meet product development schedules.• Implemented wafer grading procedures as part of a “known good die” program; consulted with other manufacturing locations and design groups on implementing these methods. Member of an on-going yield improvement team responsible for substantial defect reduction. Responsibilities ➢ Supervised and provided technical leadership for product engineering at a product development center. ➢ Worked with product development teams to bring new products to market; Acted as team leader on multiple product development teams➢ Performed detailed failure analysis and determined corrective action for product failing reliability criteria➢ Provided technical leadership to subordinate product engineers by working to develop more efficient means of analyzing results, and by providing guidance on failure analysis issues. ➢ Determined product test yield management and improvement strategies.

Achievements• Designed a custom high power current control stepper motor drive chip & simulated macro circuits for an ASIC library. • Participated in the design and layout of an RS232 driver/receiver chip, and performed design support for a DC-DC converter chip. Responsibilities ➢Designed and layout of application specific integrated circuits. Outlined designs, models, and tested prototypes for products.

Achievements• Developed and debugged several extensive test programs for mixed signal intelligent power and high voltage integrated circuits.Responsibilities ➢ Was responsible for the development and implementation of integrated circuit test methodologies.➢ Supported reliability stress test readouts, and performed detailed failure analysis on all reliability test failures.

Achievement• Completed university-industry Co-Op Program while a student at Purdue University College of Engineering. Worked 30hrs/week during school sessions and 40hrs/week during 5 Co-Op sessions. Responsibilities ➢ Generated test programs for incoming integrated circuits. Designed test systems for various hybrid microelectronic products using HP rack instrumentation. Familiarity with high voltage safety training / best practices. Knowledge of ISO test equipment calibration requirements / practices. Excellent teamwork and communication skills, documentation skills. ➢ Self-motivated with the ability to manage multiple tasks. Proficient computer skills.

Responsibilities ➢ Provided manufacturing support for a commercial hybrid “chip and wire” assembly line, including process design and implementation, process documentation, and operator/supervisor training. ➢ Supported operations, including wire bond, automated chip attach, solder reflow, lead attach, and automated epoxy dispense.

Mba

Bs, Et