Steve Trasatto Email & Phone Number

Raleigh-Durham, North Carolina Area

Owner of multiple EDA toolsets globally, including setup, support, productivity enhancements, development and dissemination of best practices, road mapping, and management of licenses for PCB and FPGA design. Main EDA flows supported are Cadence Design Authoring/Allegro, Cadence CIS/Allegro, Mentor DxDesigner/Expedition, Mentor PADS, and Altium Designer. Coordinate the complete electronic design process from libraries to layout and pushing into PLM. Drive continuous improvement of EDA processes at all development sites. Support of applications and scripts as tools, processes, and customer data requests change. Lead evaluation of new tools and/or associated training activities. Educate and enforce the use of standards in the EDA environment.

Raleigh-Durham, North Carolina Area

Regional manager of global team responsible for providing tool and process support to software, mechanical and electrical engineering R&D teams. Tools supported include Rational ClearCase and ClearQuest, Mentor Graphics Design Capture and Expedition, and Unigraphics NX. Manage regional EDA library team.

Raleigh-Durham, North Carolina Area

Responsible for application development and support for RTP originated applications as well as shared support for certain global applications. Local focal point for managing RTP team involvement and support of new global application release and support plans. Manage the group responsible for providing both mechanical and electrical engineering support to R&D. Manage staff of 14 and $8M budget.

Raleigh-Durham, North Carolina Area

Manage the support of EDA tools, libraries, mechanical CAD, and training sitewide. Develop, maintain and enhance the board level design process used by engineers and designers. Implement software tools and processes to reduce product development cycles. Define CAD and library strategy and tactics. Create software test and rollout plans. Develop web publications for online custom application support. Represent site in global CAD meetings. Analyze and manage software assets to achieve cost savings and maximum ROI. Supervise staff of up to six. Responsibility for $4M budget.

Raleigh-Durham, North Carolina Area

Design high density hand-held mixed technology telecom terminals for high volume applications. Investigate new packaging technologies for use in products. Develop, document and implement new design practices to help reduce design cycle time.

Blue Bell, Pennsylvania

Implemented specific technical solutions as part of consulting projects. Consulting projects included high-speed board layout, design environment definition, implementation and refinement, rapid prototype design process and environment, library development, and software integration. Training of client personnel. Assessed client’s design process and use of specific EDA tools, prepared and implemented project plans for improving the customer’s electronic product design process.

Holmdel, New Jersey

Contract position as Subject Matter Expert (SME) in the use of Mentor Graphics EDA tools.

Glen Burnie, Maryland

Multilayer printed circuit board design in accordance with MIL-STD-275E. Worked on towed array sonar systems for the US Navy. Designed first SMT board at the site. Contract position.

Holmdel, New Jersey

Subject Matter Expert (SME) in the use of Mentor Graphics EDA tools. Defined and implemented a CAD environment and methodology for hardware design. Trained new users in the physical and symbol part creation process, schematic capture, PWB layout techniques and increased overall CAD productivity by developing processes and procedures for all design functions. Developed and implemented detailed EDA library specification which included database structure, schematic symbol, database property, simulation model and PWB footprint requirements and manufacturing data. Built library infrastructure to enable design reuse. Created sheet-based hierarchical schematic symbols suitable for simulation. Contract position.

Warren, New Jersey

Contract position.

Greater Grand Rapids, Michigan Area

Multilayer printed circuit board design and documentation in accordance with IPC-D-275 and DOD-STD-100 for military and commercial aerospace applications. Developed automated methodology for manufacturing and checking thermal management layers resulting in significant cost savings to design, manufacturing and checking groups. Contract position.

Wilmington, Delaware

Responsible for initial setup of design function to support research in electronic materials. Duties included surface mount printed circuit board design; multilayer thick-film hybrid design utilizing unpackaged active devices and chip and wire technology; cofired ceramic hybrid design; thermal analysis of assemblies; schematic capture; 3D wireframe and solid modeling; multichip module design; microstrip and stripline test board layouts. Contract position.

Sony Ericsson Managers Program, Sony Ericsson Leading And Influencing Program

Education record

Advanced Certified Interconnect Designer (Cid+)