Paul Sun Email and Phone Number
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With 20 years experience in this industry, I'm proud that I'm still the same enthusiastic in the product innovation as my first day. It keeps me being passionate, proactive and innovative. It's also an inspriation to the people I work with to be the most proactive team.I found my strength in project management after 2-year work as a EE design engineer. With a strategy view of business needs, customer expectation, team capability, schedule possibility and invest limitation, I enjoyed my work to lead the team across marketing, engineering, procurement, manufacture and quality to develop products with leading technologies and innovative user experience. With the EE background, I've grown the my technical knowledge into mechanical, molding/chassis manufacture, thermal, EMI, RF and regulatory. My solid technical knowledge is the foundation of my project management on strategy set, schedule plan and risk management.I've accumulated rich experiences and expertise from the experts I've worked with in business strategy plan, supply chain management, customer support and quality management. It benefits in my project scope management to keep the project execution to maximize the business profit. As the communication central of a project, I can master the tons of information through daily execution, grasp the risks and opportunities, and adjust the plan and resources to optimize the deliverable.I've spent 6 years in consumer product development and moved to the leading notebook/ultrabook development on each Intel new generation platform starting 2008. I led the most leading Haswell ultrabook development in 2012, with more than $10 million and >100 people invest. It's the first PC supporting Connected Standby, which could have 10+ days standby with internet connected and fresh information updated all the way.
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Cpu Pxt Lead & Soc Engineering ManagerIntel Corporation Jul 2022 - PresentShanghai, ChinaLead a 2.5-year, $15M Datacenter processor PXT across silicon development, package development, MCP validations, assembly and tests, qualification, business development, and customer management domains. -
Engineering Manager & Sr. Program ManagerIntel Corporation Dec 2019 - Jul 2022Shanghai, ChinaEngineering Manager of solution architects for PRC Enterprise and Government on-premise data center, private cloud, and hybrid cloud. Deliver solution architecture, performance optimization, issue debug across cloud infrastructure, Software Defined Infrastructure, Big Data & Analytics to PRC top OEMs, ODMs, ISVs and end users. -
Cloud Sr. Program Manager And Engineering ManagerIntel May 2017 - Dec 2019Shanghai City, ChinaManaging the engineering program portfolio which contains 15+ sub projects every year across rack design, networking system design, storage system design and SW implementation, Data Center OS kernel/application optimization, Data Center power and thermal optimization for Performance/TCO, hard acceleration through FPGA for Cloud, AI and Big Data services, etc. In charge of the project budget, schedule and responsible for the project success and customer satisfaction.Managing a Cloud HW engineering team, across board design, system debug, system validation, mechanical, BIOS, SI, FPGA BSP, etc. since mid of 2019.
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Engineering ManagerIntel Corporation Jan 2016 - May 2017ShanghaiDelivered Intel's first All-In-One VR POC with RealSense(tm) technology in 4 months, which is equipped with active SLAM and gesture control a.k.a. Project Alloy, acting as both program manager and system architect during project planning, being the owner of the system hardware spec. Joined Perceptual Computing Gourp as Sr. R&D Program Manager in Real Sense (TM) development kit and innovations.Moved to HW engineering manager in 3 moths. -
Core Team LeadHp Dec 2013 - Jan 2016Shanghai City, ChinaLead HP mobility product line core team. Decision maker of HP CDC phone and tablets products. P&L owner and TTM owner of all HP CDC phone and tablets products. THE focal point of the HP mobility product success to HP PPS executives, be responsible for product R&D spending, product cost, delivery, and quality. In charge of the decision making on product country expansion, feature change, cost change, schedule impact, quality management, supply chain management, customer service and risk management. Leading a core team across engineering, manufacture, supply chain, marketing, service, quality from project kick off till the product end of life on the day to day execution, change control and decision making. Cooperating R&D and manufacture executions with sales & marketing on the Go-To-Marketing plan. Delivered 9 Android smartphones/tablets in 2014 to Asia, Europe, North America, Latin America, Middle East and Africa for over 1 Million units. -
Senior R&D Program Manager – Notebook/UltrabookIntel Jun 2007 - Dec 2013Shanghai City, ChinaUltrabook and notebook development and production management. Lead the product definition, architect, design, development and build of n+1/n+2 Intel platform. Manage design team, 3rd party vendors and ODM. Managed team >30 engineers, budget >10 Million/year. Lead development teams including Intel engineers and ODM engineers on notebooks/ultrabook development for global customers across Intel platforms starting 2008. Proved leadership in scope management, cost control, schedule control, supplier management, quality management and supply chain management, with solid technical depth and experiences to work with ODM/EMS. Managed the first Ultrabook supporting Connected Standby, which could have 10+ days standby battery life with connection to internet in the meanwhile. The product was used for both Intel Shark Bay platform and Microsoft Windows development, with 100+ people on design/manufacture and $15,000,000+ invest. The EMS working model was initiated and set up through the project execution which is the first time of the business unit. RC2 is the first notebook family based on a standard notebook motherboard form factor which is developed by Intel in 2008. As the RC2 chassis PM, be in charge of 4 chassis and 1 docking station development which have 3 different motherboard integrated. Manage the product architecture, design and validation to mass production; be the owner of schedule, cost and product quality. Good capability to set up and manage the supply chain for engineering build, NPI and mass production. Good experience in notebook manufacture with months on-site work in production line every year. Good experience in defining and driving industry standards at components and system level. -
System EngineerIntel Sep 2005 - Jun 2007Shanghai City, ChinaSystem engineer for desktop and notebook. Be a hardware PM. Lead the hardware engineer team in system development on notebook, net book and desktop, including EE, ME, ID, Thermal, EMC and firmware. In charge of the schedule control, defect management, quality control, components selection and ODM engineer management. Worked on Jackson Bay notebook, “Intel Inside” OLPC, Broadwater PSP HTPC and Founder Fuwa notebook development, etc. Be a technical Expert in standard and specification development. Participated the 1st laptop mother board form-factor specification (Rich Creek) as a key stakeholder and contributor. Define Intel RML (Recommended Material List) motherboard category requirements and validation vehicles on Broadwater. Be the key stakeholder of PRD, working with marketing on production definition. Be the owner of Hardware Architecture Specification, to achieve the features in PRD. Be the member of CCB (Change Control Board), to control the POR change during the development stage. In charge of electric and system development vehicles in development stage. Look over the whole development team for the most effective and most cost effective solutions. -
Program ManagerAopen Jul 2001 - Sep 2005Shanghai City, China Market researching and analysis for SFF PC’s phase-in. Make the roadmap of Bare System and System for AOpen China market, including the products for Netbar, Commercial , and manufacture. Promote the roadmap and the features to the customer in Intel’s ODM Summit Shanghai, 2004 and AOpen PRC customer visit in Hangzhou, Changsha and Chengdu. Take part in actual business. Take the role of Sales, Product Manager and Project Manager in business of Inventec’s lab PCs, Office computers for the sub-company of Shanghai Airline in Beijing, etc. Take in charge of the first run of the new factory in Chengdu, Sichuan and accomplished 2 models, totally 5,500 pcs of motherboards- Technology Documents Transfer- Purchasing, Import and delivery of the material- The assembly line status control and the quality control Cost analysis and cost control. Source for the local parts and local manufacture in the South of China. The cost could be decreased by 10%
Paul Sun Skills
Paul Sun Education Details
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Electric Engineering
Frequently Asked Questions about Paul Sun
What company does Paul Sun work for?
Paul Sun works for Intel Corporation
What is Paul Sun's role at the current company?
Paul Sun's current role is Datacenter Processor (MCP) PXT Lead.
What is Paul Sun's email address?
Paul Sun's email address is su****@****ail.com
What schools did Paul Sun attend?
Paul Sun attended Tongji University.
What skills is Paul Sun known for?
Paul Sun has skills like Pmp, Product Management, Strategic Planning, Program Management, Cross Functional Team Leadership, Intel, Semiconductors, Product Development, Management, Testing, Six Sigma, Engineering Management.
Who are Paul Sun's colleagues?
Paul Sun's colleagues are Monika Bahyrycz, Sangeri Lakshmi, Maroun Maroun, Selamawit T Mehary, Ph.d., Pe, Julia Fedorova, Runner Yang, Brian Simmons.
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Paul Sun
Executive Director Of Spotag Electronics /Rfid Tags /Rfid Laundry Tags/ Rfid On-Metal TagsSuzhou1spo-tag.com -
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2163.com, spalding.com
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