Sr. Director Of Packaging
Current-. Generative AI packaging-. 2.5D+3D/MCM packaging-. Heterogeneous integration
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@samsung.com
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Max (Sunghwan) Min is listed as Sr. Director, Package and SI/PI Architect at d-Matrix, based in San Jose, California, United States. AeroLeads shows a work email signal at samsung.com and a matched LinkedIn profile for Max (Sunghwan) Min.
Max (Sunghwan) Min previously worked as Sr. Director of Packaging at D-Matrix and Director of Packaging at Avicena Tech. Max (Sunghwan) Min holds Ph.D., Electrical And Computer Engineering from Georgia Institute Of Technology.
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AeroLeads found 1 current-domain work email signal for Max (Sunghwan) Min. Compare company email patterns before reaching out.
Max (Sunghwan) Min is a Sr. Director, Package and SI/PI Architect at d-Matrix. He possess expertise in signal integrity, rf, semiconductors, agilent ads, spectrum analyzer.
Listed skills include Signal Integrity, Rf, Semiconductors, Agilent Ads, and 1 others.
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Santa Clara, California, Us
-. Generative AI packaging-. 2.5D+3D/MCM packaging-. Heterogeneous integration
Sunnyvale, California, Us
-. Optical microLED-base packaging-. 2.5D/3D/Chiplet packaging-. Logic/Memory/AI disaggregation-. Active optical cable development
Suwon-Si, Gyeonggi-Do, Kr
-. I/X/R/B/C-CUBE and G-CUBE-. Heterogeneous package development-. HBM, GDDR, DDR, LPDDR integration-. 2.5D and 3D package development-. Automotive and nextwork package development-. AR/VR and mobile package development-. Package architect and SI/PI architect-. ISC development and marketing-. Package marketing-. Enabling new technologies, microLEDSamsung FoundrySan Jose, CA2021 IWLPC 3D Best Paper Award
Suwon-Si, Gyeonggi-Do, Kr
-. ARM-base microserver packages-. ARM-base mobile and wearable packagesSamsung System LSISan Jose, CA
Suwon-Si, Gyeonggi-Do, Kr
-. ARM-base mobile PoP/SIP/SCP package developmentSamsung Semiconductor, Inc.San Jose, CA2011 ECTC Intel Best Student Paper Award2010 Samsung Frontier Award
Atlanta, Georgia , Us
- Design director- Program manager- Design of RF/microwave/millimeter-wave SOP packages - Signal integrity and power integrity- Material and process characterizationPackaging Research CenterAtlanta, GA USA
Us
- Design of RF front-end modules- Characterization of RF organic substrates and materials- Process control monitoring- Development of filter librariesJacket Micro DevicesAtlanta, GA USA
Suwon-Si, Gyeonggi-Do, Kr
- Design and simulation of digital, RF, and mixed-signal packages- High-speed and high-performance package design and modeling- Signal and power integrity- EMISamsung System LSIKiheung, South Korea
Quick answers generated from the profile data available on this page.
Max (Sunghwan) Min works for d-Matrix.
Max (Sunghwan) Min is listed as Sr. Director, Package and SI/PI Architect at d-Matrix.
AeroLeads has found 1 work email signal at @samsung.com for Max (Sunghwan) Min at d-Matrix.
Max (Sunghwan) Min is based in San Jose, California, United States while working with d-Matrix.
Max (Sunghwan) Min has worked for D-Matrix, Avicena Tech, Samsung Electronics, Georgia Institute Of Technology, and Jacket Micro Devices.
You can use AeroLeads to view verified contact signals for Max (Sunghwan) Min at d-Matrix, including work email, phone, and LinkedIn data when available.
Max (Sunghwan) Min holds Ph.D., Electrical And Computer Engineering from Georgia Institute Of Technology.
Max (Sunghwan) Min is listed with skills including Signal Integrity, Rf, Semiconductors, Agilent Ads, and Spectrum Analyzer.
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