Max (Sunghwan) Min work email
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Max (Sunghwan) Min personal email
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Max (Sunghwan) Min is a Sr. Director, Package and SI/PI Architect at d-Matrix. He possess expertise in signal integrity, rf, semiconductors, agilent ads, spectrum analyzer.
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Sr. Director Of PackagingD-Matrix Aug 2024 - PresentSanta Clara, California, Us-. Generative AI packaging-. 2.5D+3D/MCM packaging-. Heterogeneous integration -
Director Of PackagingAvicena Tech Oct 2021 - Jul 2024Sunnyvale, California, Us-. Optical microLED-base packaging-. 2.5D/3D/Chiplet packaging-. Logic/Memory/AI disaggregation-. Active optical cable development -
Director, Package And Si/Pi ArchitectSamsung Electronics Apr 2018 - Oct 2021Suwon-Si, Gyeonggi-Do, Kr-. I/X/R/B/C-CUBE and G-CUBE-. Heterogeneous package development-. HBM, GDDR, DDR, LPDDR integration-. 2.5D and 3D package development-. Automotive and nextwork package development-. AR/VR and mobile package development-. Package architect and SI/PI architect-. ISC development and marketing-. Package marketing-. Enabling new technologies, microLEDSamsung FoundrySan Jose, CA2021 IWLPC 3D Best Paper Award -
Sr. Engineering ManagerSamsung Electronics Sep 2011 - Mar 2018Suwon-Si, Gyeonggi-Do, Kr-. ARM-base microserver packages-. ARM-base mobile and wearable packagesSamsung System LSISan Jose, CA -
Sr. Packaging StaffSamsung Electronics Dec 2009 - Aug 2011Suwon-Si, Gyeonggi-Do, Kr-. ARM-base mobile PoP/SIP/SCP package developmentSamsung Semiconductor, Inc.San Jose, CA2011 ECTC Intel Best Student Paper Award2010 Samsung Frontier Award -
Design Director, Research Engineer IiGeorgia Institute Of Technology Nov 2008 - Nov 2009Atlanta, Georgia , Us- Design director- Program manager- Design of RF/microwave/millimeter-wave SOP packages - Signal integrity and power integrity- Material and process characterizationPackaging Research CenterAtlanta, GA USA -
Sr. Rf Design EngineerJacket Micro Devices Dec 2005 - Oct 2008Us- Design of RF front-end modules- Characterization of RF organic substrates and materials- Process control monitoring- Development of filter librariesJacket Micro DevicesAtlanta, GA USA -
Sr. Signal Integrity EngineerSamsung Electronics Jun 2004 - Nov 2005Suwon-Si, Gyeonggi-Do, Kr- Design and simulation of digital, RF, and mixed-signal packages- High-speed and high-performance package design and modeling- Signal and power integrity- EMISamsung System LSIKiheung, South Korea
Max (Sunghwan) Min Skills
Max (Sunghwan) Min Education Details
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Georgia Institute Of TechnologyElectrical And Computer Engineering -
Georgia Institute Of TechnologyElectrical And Computer Engineering -
Hanyang UniversityElectronics Engineering
Frequently Asked Questions about Max (Sunghwan) Min
What company does Max (Sunghwan) Min work for?
Max (Sunghwan) Min works for D-Matrix
What is Max (Sunghwan) Min's role at the current company?
Max (Sunghwan) Min's current role is Sr. Director, Package and SI/PI Architect.
What is Max (Sunghwan) Min's email address?
Max (Sunghwan) Min's email address is su****@****ail.com
What schools did Max (Sunghwan) Min attend?
Max (Sunghwan) Min attended Georgia Institute Of Technology, Georgia Institute Of Technology, Hanyang University.
What skills is Max (Sunghwan) Min known for?
Max (Sunghwan) Min has skills like Signal Integrity, Rf, Semiconductors, Agilent Ads, Spectrum Analyzer.
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