My name is SunShine Chen_陳桑雄, within more than 20 years semiconductor experience . From PE engineer , TD engineer , FAE then to marketing research , tester configuration survey and logic wafer sort Product Engineering _PE department manager , experienced to manage the department and coordination among the customers , departments and ATE venders furthermore in charge of the probe card company. Significant Achievements: 1.From 1996~2002 SRAM Yield improvement and DRAM new technology (110nM process node) development, strategic marketing development.2.2002 Intel flash memory product lead-in project leader.3.2003 RF production line assessment and build-up.4.2004 wafer level package capability set-up.5.2002~2004 ATE configuration assessment.6.2006 SOC tester design win at TSMC/Freescale , AES/ASEJapan , MTK , and Winbond. Business Strategic development7.KGD/MCP and TSV capability building-up. 8.In charge of probe card(cantilever, vertical, MEMS type and direct docking type) company manufacturing. Project or case coordinator among global sites( including China, Singapore, US, and VN sites.) Managing AE, quality assurance and customer supports.9.Filed a vertical probe card related patent in 201610.New technology survey/lead-in, business strategic development, market/competitors analysis 11.In charge of Product Testing Engineering department to handle the PCM(Phase Change Memory) from design, engineering to production phases.