Principal Quality Management System Lead Auditor - Focus on supporting customer and certification audits and performing internal audits.

ISO 9001:2015 WITH IATF 16949:2016

• Achieved a 50% reduction in vapor dep scrap metrics by eliminating root causes and by reducing the probability of occurrence for other root causes utilizing gauges and operator training.• Conducted DMAIC project to reduce vapor dep pump down times allowing for 50% cycle time improvement while maintaining product quality.• Managed a team of 4 in researching and developing future vapor dep technology with intent to replace antiquated systems.• Initiated monthly “PIT” meetings with operators to discuss production changes and issues in order to maintain reduced scrap and identify continuous improvement actions for the area.

• Developed and initiated new OCAP (Out of Control Action Plan) program using flow charts with technician and engineering signoff which guided engineering to a reduced failure rate of product characterization by 12%.• Reduced product defects 22% by implementing a changeable quartz exhaust insert used during the product deposition.• Implemented wet bench molarity monitoring utilizing conductivity sensor in preparation for eliminating existing titration methods resulting in reduced costs.• Monitored and reported monthly CPK performance for existing production lines.• Defined and executed action items associated with improving CPK performance resulting in a 30% improvement of parameters meeting CPK goals.• Obtained and Qualified second source material for a 59% cost savings.

• Performed startup characterization and release to production of 2 Metrology systems, Flexus and Metapulse, and 4 additional PVD cluster tools for 80% increased wafer starts per week on the BAW production line.• Designed and executed an advanced process control scheme for monitoring and sustaining critical device performance metrics such as device coupling.• Engineered new processes by performing DOE on HSE module process parameters for 50% increase in throughput.• Evaluated new chamber shielding to improve cost and solve problem of micro arcs with original process chamber shielding.• Facilitated PVD technician training classes for improved manufacturing response and process control procedures.• Developed new methodology for monitoring low Cpk performance SPC charts called DMAIC targeting Cpk improvement of individual charts which resulted in W thickness improvement from 1.12 to 2.56 CPK.• Developed and Implemented incoming inspection system for quality assurance of received PVD targets.

Designed integration experiments for development of new technologies.

• Increased capacity 30% by implementing a multi-chamber processing strategy on PETEOS films.• Implemented on product measurements for SACVD PSG resulting in a >$66K / year cost savings.• Developed new process clean strategy to reduce particle levels for SACVD PSG process.• Launched advanced process control strategies such as process works, full recipe content download, and TIMS across multiple processes.• Performed process qualifications and developments on Applied Materials’ Endura PVD systems for 200mm FRAM technology using films such as Aluminum Oxide, Iridium, Iridium Oxide, and TIALN.• Provided process engineering support and SPC review of the entire manufacturing line for new technology rapid learning cycle qualification.

• Performed process qualifications and startups of Applied Materials’ Chemical Mechanical Polishers for 200mm and 300mm systems, standalone and cleaner integrated systems for oxide, nitride, tungsten, and copper films.• Developed new processes for customer satisfaction reducing non-uniformity by 50% and reducing defect levels by 20% on 300mm ILD processes.• Performed defect inspections using Applied Materials SEMVISION, guiding customers to root cause of defect excursions.

• Proposed and implemented Quality Incident Reporting process to track the reliability of operations and ensure continuous improvement.• Assisted in development of the Quality Manual in preparation for ISO 9000 certification.• Coordinated and performed ISO 9000 Internal Quality Audits among all departments and operations of the organization to learn areas of improvement for the company.• Initiated Customer Satisfaction Process using surveys and one-on-one interviews with the customer for Local Customer Support Operations to understand our customer’s views of our support.

• Performed process qualification release to production for 14 pieces of equipment, 8 TEL8500ATC etchers, 3 TEL Unity 85DI etchers, and 3 Tencor / Prometrix UV1050/1250 thickness measurement tools for increased fab capacity. • Monitored equipment / process performance via SPC (Statistical Process Control) for throughput, yield, parametric, and defect trends to maintain company’s record yields.• Trained incoming Plasma Etch process engineers, process technicians, and operation specialists aligning them with the correct procedures for processing product or performing tasks necessary to their job functions.