Selling and marketing Quha assistive technology medical device solutions for B2B customers. Using CRM as main tool to handle multiple accounts globally. Strong input in new product development projects and product concepts especially innovating new product concepts. Contribution in HW development and mechanics especially in product management, productization and component engineering aspects. Key achievements: Sales increased up to 40% and new product was developed and launched to markets. Future concepting for new products using innovative technologies.

Selling and proposing component soutions for customers and increasing customerbase.

I work in customer interface and I'm responsible for customer prototype and product rampup from offer to electronics assembly and mechanical assembly and testing. Also materialavailability and customer order handling are my responsibility. I created product structures to ERP from partlist to pricing.

taking care for children

I was working in customer interface and my main task was to ensure that customer requiremens were fulfilled for FPGA IP and SW. I collaborated with chip IP and SW design teams to make sure all relevant features are implemented and tested properly. I managed to keep deliverables on time and customer happy despite of technical challenges. Jira, Confluence and MS project were main tools used

taking care for newborn

I was working in sales organization as Senior FAE. This role was really to be close to customer and fulfilling customer needs from technical to commercial items. I was working in the office based in Helsinki then in Tampere. I was focusing on big developing wireless accounts, but I also worked with industrial companies and local component distributors. I was first point of contact to give technical support to customers in Finland and as being first point of contact, I handled variety of commercial items too. Role was very independent as I was working alone in Finland and required working remotely with Paris sales office.Key task was to work with customers and internal business units to find technical solutions for customer systems. Work required a lot of detailed technical discussions with designers and experts. I also participated to commercial discussions with sourcing and management.My everyday work included planning, preparing and having customer meetings independently or in co-operation with account manager and business units. Also specifying and defining new components and promoting available portfolio for customers was my role. In case of bugs, my role was to drive business units to solve it and keeping progress transparent to customer.Versatile role included:-Managing current long term customer relationships and creating new ones.-Acting as interface between customers and internal Business units.-System studies for TAM and SAM analysis.-Sales strategy planning to identify all business opportunities.-Promioting component portfolio to customers.-New product idea proposals based on discussions with customers.-Component proposal for customers.-Participating to price negotiations.-Managing customer sample requests.-Handling requirements for customer specific milestones and component approvals.We managed to get great design wins in complicated systems involving efforts from many companies, but also with discrete products.

I was leading Mixed-Signal ASIC projects.This role was truly taking ownership of project.This role was international and multi-site co-operation with ASIC supplier.I was customer side responsible for component project. I was responsible for milestone reviews and my task was to ensure availability of required documents and drive accomplishing all actions. Also one important task was to lead error management and create recovery plans with supplier. Also internally was acting as interface between internal stakeholders (baseband team, product program) and supplier in international environment. I was not only leading the component project, but I took responsibility for various engineering tasks during development phase:-Defining component requirements with system design and baseband team.-Pre-silicon simulation planning and reviewing results-Validation planning and test case definition & result review-Hands on testing with test board-Characterization planning and result review-Mass production test case definition-Internal HW/SW synchronization.-Qualification planning with quality manager & review results-Package planning with packaging specialist.Achievements: ASIC approved to production and Product was launched successfully. In parallel of project lead work I was responsible that all system level relevant testing were accomplished according to baseband test plan on ATE environment.

This role was next step from MSIC design engineer. I had full responsibility and ownership for specification and requirements. Other responsibilities:-Close collaboration with supplier, baseband team and Product program.-Pre-silicon validation and results review.-Collaboratig with test engineers to ensure good test coverage.

Close collaboration with international semiconductor suppliers. The focus was in complex power management MSIC components including several SMPS's,LDOS, Charging, Audio, system control and USB logic.My main responsibilities were component specification development, requirements handling and simulation planning and result review. I also worked with testcase definition and result review.Close interaction with internal Baseband team to ensure component requirements were aligned internally.I was also responsible in generating internal system level integration specification for accessory detection.

At First I studied Optical signal transmission inside PWB.After that I soon joined to research group to study and model thermal conductivity in nanoscale environment. I published one study for this area:"Computational studies of nanoscale heat transfer"I also continued as assistant for following cources:Microelectronics lab cource, -Design sigmadelta modulator with CadenceElectronics labratory 1,-Basic measurements in labCommunication Electronics Laboratory

Masters Thesis:"Curvature corrected Bandgap Voltage reference"I designed cuvature corrected bandgap voltage reference IC with Cadence. Design was started by selecting topology for this CMOS design. Then schematic was designed and simulations done. Layout was also optimized and finally protypes were tested. Different topologies were tested to compare accuracy.Publification was also made:"Improved CMOS Bandgap Voltage Reference"I was also assistant for following cources:Microelectronics lab cource, -Design sigmadelta modulator with CadenceElectronics labratory 1,-Basic measurements in labCommunication Electronics Laboratory