-Assist in developing and integrating advanced semiconductor materials, contributing to enhancing device performance and repeatability.-Conduct material characterization on various plating materials including Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG), Electroless Nickel Immersion Gold (ENIG), and silver.-Conduct material characterization and failure analysis using optical and Scanning Electron Microscopy (SEM) techniques.-Prepare samples for optical microscopy and SEM by cutting, accurately mixing epoxy, delicately potting to maintain alignment, cross-sectioning with precision, and polishing/etching to ensure high-quality imaging.-Support the optimization of vendor selection through experimental design and extensive data analysis, leading to improved yield and efficiency in the field.-Conduct extensive thermal cycling tests on PCB test coupons with different laminate materials using a fluidized sand bath, employing electrical response and qualitative analysis to verify reliability and check for interconnect defects.-Conduct experiments with various surface cleaning techniques, including atmospheric plasma systems, adhesive materials, and mechanical methods. Utilized fluorescence meters, dyne test pens, and Fourier Transform Infrared (FTIR) spectroscopy to assess and characterize surface cleanliness.-Conduct comprehensive First Article Inspections (FAI) to ensure compliance with customer specifications.-Perform detailed dimensional and visual inspections to verify product conformity.

•Provide academic support for students in traditionally difficult courses and help students experience a higher rate of success and overall better grades.•Facilitate student-led study and discussion groups outside of the classroom.•Offer guided study sessions.•Connect students with faculty members.

•Perform the set-up of flat panel x-ray systems for virtual panels and command processors by transmitting and verifying the correct software, firmware, and configuration files.•Perform calibrations, create defect maps, and analyze images and videos per Receptor Acceptance Test Procedures.•Troubleshoot abnormalities, rework systems as needed, and diagnose failures. Document findings and communicate to appropriate teams with recommended solutions.•Prepare technical reports and checklists upon completion of all tests with passing specifications per customer expectations and internal requirements.

-Proactively identified and analyzed problems of varying complexity daily. Worked swiftly to find root cause and formulate a plan in order to prevent risk to wafers and stop potential excursions. Initiated contact and worked with other areas as needed.-Disposition wafers, processes and equipment by following reaction mechanisms and analyzing process control charts. Used knowledge learned from work experience to react to failures that had not been seen before and thoroughly documented findings. Investigated all possibilities and beyond the scope of what was expected in my role before escalating to on call engineers or process owners for guidance or permission.-Worked closely with engineers and process owners to help with the development of 3DxP NAND and DOEs by performing tests such as reworks or special work requests, and providing feedback to help increase the stability of the processes.-Actively took part in training classes and workshops, met one-on-one with process and equipment supervisors and delivered new hire training on all processes and workstations.