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Syed Abdullah Email & Phone Number

Principal Engineer at Harman International at HARMAN International
Location: Dallas-Fort Worth Metroplex, United States 7 work roles 2 schools
1 work email found @flex.com LinkedIn matched
✓ Verified July 2026 4 data sources Profile completeness 100%

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Current company
Role
Principal Engineer at Harman International
Location
Dallas-Fort Worth Metroplex, United States
Company size

Who is Syed Abdullah? Overview

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Syed Abdullah is listed as Principal Engineer at Harman International at HARMAN International, a with 10 employees, based in Dallas-Fort Worth Metroplex, United States. AeroLeads shows a work email signal at flex.com and a matched LinkedIn profile for Syed Abdullah.

Syed Abdullah previously worked as Principal Engineer at Harman International and Sr. Staff Electrical Design Engineer at Flex. Syed Abdullah holds Msee, Digital Signal Processing from The University Of Texas At Dallas.

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{first}.{last}@flex.com
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Profile bio

About Syed Abdullah

RF/Electrical engineer with 15 years’ experience in hardware, system design, simulation, characterization and verification. Self-motivated professional with passion for consumer, industrial and healthcare product design from concept to production. Excellent analytical and problem-solving skills that function well to meet stringent deadlines. An adaptable team player that thrives on challenge with ability to work with cross-functional and cross geographical teamsSpecialties:● 10+ years of experience in electrical circuit design and board bring up with ARM processors, mixed signal, high speed digital signal, power ICs, sensors and SoCs● 7+ years of experience with SoC module design, testing and certification for WLAN[ac/a/g/n with MIMO], BT4.2, FM, Zigbee● 7+ years of experience in system and circuit design/build/test Medical Class 2 devices and battery powered consumer products● 10+ years of electrical and system design of sketch to scale solutions for industrial, health, home automation and consumer applications● 10+ years of experience in manufacturing and engineering support, including outsourcing support● 7+ years of experience in project planning for EE activities, develops EE estimates [resources, risks, goals] for future and existing projects● Collaborate with customers, supply chain, PMs [on schedule and budget], ME, SW and PCB engineers with relentless drive to win

Listed skills include Rf, Wlan, Wireless, Wimax, and 27 others.

Current workplace

Syed Abdullah's current company

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HARMAN International
Harman International
Principal Engineer at Harman International
642 S Santa Fe Ave Vista, California 92084-6104 United States
Employees
10
AeroLeads page
7 roles

Syed Abdullah work experience

A career timeline built from the work history available for this profile.

Sr. Staff Electrical Design Engineer

Austin, Texas, Us

Organ Perfusion System (Class 2 Device)• Design board with ARM Cortex-A35 processor with Cortex-M4F, PMIC, Ethernet, LVDS, IMU, Fluid sensors, Wi-Fi, BLE, NVME M.2 SSD, motor driver, optic sub-system, and USB3.0 with PD. Design per ISO-13485 and IEC60601-1 and IEC60601-1-2• Performed component obsolescence review, and update design with new features• Led electrical and layout team across NA, ME, and Asia • Performed board bring up in lab, debug for hardware/FW issues, co-author test plan and performed electrical testing using oscilloscopes, spectrum analyzers, logic analyzers, and DVMs• Worked with ME and PCB designers for signal routing, integration, manufacturability, DFM and DFA assessment• Worked with PM on planning, budgeting, WBS schedule, and coordinates project activities related to electrical design• Performed USB3.0 signal integrity testing with power delivery• Collaborated with external and internal suppliers for component procurementRadio Connectivity Module for AED• Design LTE CAT M1/NB-IoT radio connectivity solution with global roaming• Collaborated with antenna designers and ME on antenna placement for optimal over-the-air performance• Test several antennas inside AED and down select one with best efficiency, TRP and TIS• Worked with external lab to define global certification and regulatory test plan

Mar 2019 - May 2023

Staff Electrical Design Engineer

Austin, Texas, Us

Medical Alert System (Class 2 Device)• Design electrical/RF electronics using 4G LTE CAT1 radio module for AT&T network• Worked with antenna designer on simulation, integration and antenna characterization of 4G LTE CAT1 and 900MHz WLAN antennas• Performed board bring up in lab, debug for hardware/FW issues and performed electrical and RF characterization• Worked with ME and PCB designer for antenna placement, integration and manufacturability • Lead FCC/ISED, IEC60601-1 and FDA wireless coexistence testing activities at test labs• Lead AT&T network readiness testing • Support NPI activities Smart Garment with Bio-sensing• Design board with ARM Cortex-M7, PMIC, Ethernet, RS-485, ADC, PPG and temp sensors for ECG, respiration, PPG and EMG monitoring integrated inside bio-sensing garment • Used dry electrodes with localized compression to minimize slippage or dislocation due to the motion of wearer• Electrical connectivity among various sensor nodes was achieved using RS-485 protocol over flexible and stretchable substrate of the garment• Worked with PCB designers on board layout of high speed signal routing [memory and digital signals] in accordance with EMI/EMC best practices, RF signal integrity and DFA/DFM reviews• Worked with ME and Textile designers for electrodes placement, thermal analysis and manufacturability of smart garment• Performed board bring up in lab, debug for hardware/FW issues and performed electrical characterization

Jul 2017 - Feb 2019

Electrical Design Engineer

Austin, Texas, Us

IIoT design of smart hat • Design to monitor SpO2, heart rate, temperature, humidity, pressure and external force.• Design electronic circuit to detect and process data from CO, H2S, O2 and hydrocarbon gas sensors with actuation and interface with main board using 16/24 bit ADCs. • Design wireless subsystem using WLAN 2.4/5GHz, GPS, and Bluetooth 4.2 module • Audio architecture design included dual digital mics for noise cancellation, ANC audio codec and Class D amplifier speakers.• Video monitoring with still images using camera with hardware encoder.• Design main board with ARM Cortex-A9 processor, PMIC, DDR3, Ethernet, USB2.0, SPI, I2C, SDIO and Buck-Boost. • Wrote test plans for board bring up and electrical/RF characterization and developed system power tree.• Worked with PCB designers on board layout of high speed signal routing [memory and digital signals] in accordance with EMI/EMC best practices, RF signal integrity and DFA/DFM reviews.• Worked with ME designers for placement, thermal analysis and manufacturability. • Performed board bring up in lab, debug for hardware/FW issues and performed electrical characterization IoT tracker for smart apparel • Design electrical and RF subsystems of IP57 smart clothing accessory for monitoring back posture while running, sitting and standing using 9-axis IMU and communicated data to smartphone over BLE. • Performed system reliability tests including vibration, shock, chemical immersion, temperature cycle test and FCC part 15 emission compliance.Smart home gateway• Design home gateway system to control smart window blinds, door locks and garage doors via smart home application using LoRA [433MHz] and Z-wave [850MHz]• Performed complete Apple HomeKit and Z-wave certification, wrote compliance test report with SW logs for Bonjour test and self-certification audit test cases

Jul 2015 - Jun 2016

Ic Design Verification

Santa Clara, Ca, Us

Design, debug, lab bring up and characterization of NVIDIA RFIC [WCDMA and LTE] HW platform, non-signaling verification and optimization of TX-RX blocks.• Performed RFIC bench validation for gain, IIP2, NF, phase noise, S parameter, output power, EVM, ACLR, IQ offset, PLL spurs and settling time, RXBN, spurious analysis, out-band emission measurements, IQ and CS calibration.• Performed PVT characterization of RFIC [nominal and corner lots] and worked with IC design team for performance optimization of analog, digital and RF blocks.• Design hardware platform and developed test plans for lab testing• Presented design analysis and recommendations to IC design team and performed detail oriented technical design reviews• Extensively worked with PXA N9030A, E5052B signal source analyzer, wireless communication analyzer, N5182B MXG, logic analyzer and oscilloscopes.• Wrote test scripts in MATLAB and Python for bench testing and characterization

Nov 2013 - Jun 2015

Sr. Rf Design Engineer

Waterloo, Ontario, Ca

Electrical and RF hardware design of BB7 and BB10 based computing platform that included smartphones and tablets from concept design to production readiness• Design advance wireless connectivity solution with WLAN a/b/g/n/ac/2x2MIMO with BT4.0, BLE and FM using Broadcom, TI and Qualcomm-Atheros SoCs• Design RF front-end that supported downlink LTE CA using APT/ET power amplifier• Design board with RF, analog and digital components, DC-DC converters, power management unit, CPU/AP, RFIC using HDMI, USB, MIPI, SPI, Ethernet, I2C communication interface• Performed RF matching of radio transceiver for optimal RF performance to meet 3GPP and carrier requirements. This included load and source pull for PA and LNA using Maury tuners and subsequent simulation using ADS for best impedance match circuit, component evaluation (FEM, duplexer, diplexer, PA, filter, RF switch) for IMD, stability and measured performance using CMU200, CMW500, VNA, VSA, VSG and power meter.• Worked closely with engineering/modem development teams on cross-functional issues related to architecture (performance, power consumption, thermal behavior), production (quality, FA and manufacturing) and development (system/board bring up, debugging and integration)• Performed system level co-existence testing of co-located radios – WLAN/ BT with CDMA/GSM/UMTS/LTE, including co-existence with LTE-B7 and B41.• Debug circuits with USB, I2S, comparators, amplifiers, LDO and DC switchers for skew, spurs, crosstalk, and impedance mismatch• Worked with antenna designers for various OTA and SAR measurements to conform to regulatory emission and carrier TRP and TIS requirements• Troubleshoot signal de-sense related to display, camera FF/RF, IMU, DC-DC switching frequency, high speed memory and system clocks. Worked closely with RF/HW/antenna teams to optimize board layout

Sep 2010 - Nov 2013

Senior Rf Engineer

Nagaokakyo-Shi, Kyoto, Jp

Design WLAN, Bluetooth, FM, Zigbee and WiMAX modules in single and dual antenna configurations with customized RF front-ends for smartphone, PDA, tablet, data dongle and health monitoring devices using leading OEM solutions; Marvell, TI, Broadcom, Ember/Silicon Labs, Atheros, Beceem and Sequans. • Worked with IC designers to address issues related to poor EVM due to IQ mismatch, DC power latch-up, on-chip TX calibration optimization, insufficient RF switch timings leading to ACPR failure• Wrote test plans to characterize IEEE 802.11a/b/g/n, BT, FM, Zigbee modules for EVM, ACPR, sensitivity and transmitter tests using Agilent signal generators, spectrum analyzer, power meters, LitePoint IQ, CBT tester, network analyzer and vector signal analyzer• Performed temperature, voltage range, humidity, drop and other reliability tests for production readiness along with statistical analysis• On-site customer support to facilitate module seamless integration on customer platform. Worked extensively with customers to troubleshoot, module bring up and offered high level of customer satisfaction • Performed failure analysis including performance and functional failure of modules on customer platform• Worked with vendors and technology suppliers for component selection and design specification requirements• Lead regulatory and technical certification of modules for FCC and Z-wave• Performed RF impedance matching for optimal antenna and conducted in-band performance • Design 802.15.4 based RF modules targeted for smart energy, smart meters, home automation and health monitoring• Used traffic and protocol analysis tools such as Ixia Chariot and Omnipeek, Wildpackets for system performance evaluation

Apr 2006 - Sep 2010
Team & coworkers

Colleagues at HARMAN International

Other employees you can reach at pioneerelectronics.com. View company contacts for 10 employees →

2 education records

Syed Abdullah education

Msee, Digital Signal Processing

The University Of Texas At Dallas

Be Computer Systems

Ned University Of Engineering And Technology
FAQ

Frequently asked questions about Syed Abdullah

Quick answers generated from the profile data available on this page.

What company does Syed Abdullah work for?

Syed Abdullah works for HARMAN International.

What is Syed Abdullah's role at HARMAN International?

Syed Abdullah is listed as Principal Engineer at Harman International at HARMAN International.

What is Syed Abdullah's email address?

AeroLeads has found 1 work email signal at @flex.com for Syed Abdullah at HARMAN International.

Where is Syed Abdullah based?

Syed Abdullah is based in Dallas-Fort Worth Metroplex, United States while working with HARMAN International.

What companies has Syed Abdullah worked for?

Syed Abdullah has worked for Harman International, Flex, Nvidia, Blackberry, and Murata Electronics - Module Business Unit.

Who are Syed Abdullah's colleagues at HARMAN International?

Syed Abdullah's colleagues at HARMAN International include Amichay Elnekave, Gavyn Cupido, Mohammad Shamsher, Deirdre Pettigrew, and Amanjot Dhaliwal.

How can I contact Syed Abdullah?

You can use AeroLeads to view verified contact signals for Syed Abdullah at HARMAN International, including work email, phone, and LinkedIn data when available.

What schools did Syed Abdullah attend?

Syed Abdullah holds Msee, Digital Signal Processing from The University Of Texas At Dallas.

What skills is Syed Abdullah known for?

Syed Abdullah is listed with skills including Rf, Wlan, Wireless, Wimax, Cellular Communications, Spectrum Analyzer, Lte, and Analog.

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