1. Main role# Tester&Handler(SLT) setup for SIP test# Test environments optimization# Failure analysis (Root cause analysis in test or A'ssy process)# Automation for tester maintenance and data analysis2. Details# Tester & Handler setup, optimization from NPI to MP * UPH @MP=750 (Target goal=720) * First pass yield 96.8% (Target FPY=over 95%) * Customer audit spec control & satisfaction with customer communication * External noise interference minimize# SOP setup for maintenance&transfer * Summarize the guide line for maintenance * Maintenance efficiency improvement due to SOP# Failure root cause analysis * With monitoring failure mode, and then check the root cause in test or assembly process. * Process capacity analysis with using cpm, means (Based on JMP data analysis) * If need more analysis, proceed the additional manual test & request the Xray&LIT analysis# Automation with python script * Daily monitoring report automation (Input count, Failure count/rate, Yield, Feedback for failure) -> Total running time = 50secs (95% Time reduction) * Tester Maintenance Automation (Auto-system reboot & log delete etc) * Daily auto mail report (Check the expiration date on RF generator in real time & send the data on mail) * Tester status real-time check (If checked some failures, auto-report is sent)# Maintenance automation with IoT development based on F/W control * Improve the signal disconnection on tester RF generator. * Relay switch ON/OFF with RaspberryPi F/W control (RF generator power auto ON/OFF)# Cost reduction * Maintenance Automation (M'TRL down time save=0.5hr/lot, CapEx Avoidance=$258.83/month) * Improve the calibration period time on RF generator. (Propose the new manufacturing lines for RF generator re-calibration) * DUTs cleaning period review & period optimization (5-times/15DUTs -> 1-time/10DUTs, Cost reduction=$15.68/day)

1. Main roles# Analog baseband logic design# PCB layout(Artwork) design # PBA verification2. Details# Thermal couple ADC logic 1) Issue * Heater temperature sensing 2) Result: * Thermal Couple IC -> AMP IC replacement, design. * PCB layout redesign, ADC signal noise improvement after added decoupling cap * TDR cost reduction. ($2.0→$0.5)# System power improvement 1) Issue * Voltage swing occurs due to overpower and Power Off issue occurs during device operation * Parts DCR verification for Power loss minimization, Voltage drop verification 2) Result: * Verification that the allowable current of electronic components does not warrant specification * Electric parts replacement, Widen the Power line pattern width for current capacity# SMPS Converter Logic design & verification 1) Issue: * Compare the wireless charger IC Logic & Gate driver Logic 2) Result: * Compared to full-bridge logic based on wireless charger IC, Half-bridge logic based on gate driver can transfer equivalent energy to the loader, system power improvement. (TDR cost reduction)# Parts selection & eBom standardization * Increasing PCB mount capacity through dualization of electric parts * Cost reduction 15% save# Electric parts signal debugging: Input/output, noise level review @PBA operation * Set the device specifications with PBA electrical check list * Communication with customer# Wireless charger Tx Module schematic, PCB layout design. (Tool: PADS) 1) Issue: Wireless charging function added during Mockup development phase 2) Result: Tx&Rx Wireless charging Efficiency 85%