Babak Talebanpour Email & Phone Number

Saint Paul, Mn, Us

Saint Paul, Mn, Us

Greater Minneapolis-St. Paul Area

I am responsible for advancing microelectronic packaging technology through Ideation, modern Microelectronic Design, Material Selection, Technology Scanning, Competitive Benchmarking, and Finite Element Modeling. I pursue the newest packaging technology, carrying out fitness for use studies, driving down microelectronic package size, improving package functionality and ease of manufacturability.Responsibilities:• Led the development, ie. definition, design, manufacturing, design verification, reliability verification, and qualification, of multi-chip modules. • Developed microelectronic packages with advanced technologies including; Embedded SoC, Flip chip on flex, Folded Flex packages, Package on Package, Wirebond die stack, and 3D stacking.• Led packaging pathfinding, established relationship with suppliers and subcontractors to develop roadmaps and develop packages with new technologies eg. FOWLP and TSVs.• Ran decision analyses, DFMEAs, and risk registers.• Designed, and implemented DOEs for tens of projects. • Completed numerous comprehensive Root Cause Analyses.• Collaborated with OSATs on failure analyses and corrective actions.• Participated in process development for new microelectronic designs.• Performed Finite Element Analyses on microelectronic packaging concepts, and production packages to evaluate Thermo-mechanical robustness.• Performed exhaustive Technology Scanning and benchmarking of microelectronic packaging industries. Monitored packaging roadmaps and trends eg. chiplets, interposers, heterogeneous integration.

Pullman, Wa

• Responsible for $1 M equipment operations across three laboratories. • Installed new equipment (white light interferometer) and relocated existing equipment (scanning electron microscope and dynamic mechanical analyzer).• Trained 15 graduate students on equipment use, research techniques, and laboratory policies.• Oversaw inventory and supply for laboratories, including scheduling consumable orders.

Pullman, Wa

Fracture Behavior Characterization of Simulated Microbumps • Implemented SolidWorks to build CAD model of sample/experimental setup.• Fabricated over 200 simulated microbump samples (20μm thick) with various morphologies by analytically modeling the kinetics of intermetallic growth.• Performed fracture tests, analyzed data, calculated percent of different fracture modes.• Devised and produced the world’s first fracture mechanism map for simulated microbumps. • Increased the toughness of the solder joints at least 25% by redesigning the joints’ configuration.• Prepared multiple reports and presentations for Semiconductor Research Corporation.• Presented project accomplishments in Semiconductor Research Corporation annual meeting (June 2014).Modelling Creep of Solder Joints at Simulated Service Conditions • Fabricated solder joints with microstructures simulating samples in storage and at service.• Performed indentation 350 creep tests, analyzed data, and measured characteristic creep parameters.• Developed a new composite model and validated the model with experimental data.• Achieved approximately 5% more accurate predictions with the new model compared to previous models.• Prepared 6 quarterly reports, 1 midterm report and 1 final report, presented to Strategic Environmental Research and Development Program.Characterizing/Modelling Microstructural Evolution in Solders During Thermomechanical Excursions• Implemented multiple microstructural characterization techniques to measure the key microstructure parameters as the joints were subjected to thermomechanical excursions.• Created a prediction graph to integrate all data into one source.

Pullman, Wa

• Taught 25 graduate students in Advanced Materials Science• Assisted primary instructor in educating 100 undergraduate students in Introduction to Materials Science

Doctor Of Philosophy (Ph.D.), Materials Science And Engineering/Mechanical Engineering, 3.88

Master Of Science (M.S.), Mechanical/Materials Engineering

Bachelor Of Science (B.S.), Materials Engineering