Ultrasonic Fingerprint Commercialization: I was responsible for directing and coordinating multi-disciplinary and geographically dispersed engineering teams across China, Taiwan, India, and the US.My role involved supporting customer commercialization activities, including SW/Algo development,KPI improvement, customer communication & expectation management, etc. I developed, recruited, and led engineering team in China to successfully commercialize 15+ ultrasonic fingerprint products with major China/Japan OEMs.Multimedia Power Optimization & Low Power Architecture Design: I oversaw a team that enhancedmultimedia power efficiency across various multimedia technologies (audio/video, camera, display, gaming). I led a team and spearheaded investigations into SoC power architecture and devised a roadmap for next-gen SoC development. This encompassed the optimization of power management infrastructure, DDR system, IP core power management, PMIC efficiency, etcMultimedia & SoC Competitive Analysis: I led a dynamic team of experts from diverse disciplines in conducting a comprehensive competitive analysis of major System-on-a-Chip (SoC) competitors. Our focus was on analyzing aspects of power, performance, and cost related to CPU, GPU, camera, video, display and DDR.DSP Firmware Engineer & Lead: I supervised a team responsible for crafting DSP firmware architecture deployed across multiple Qualcomm SoC generations, emphasizing diverse multimedia technologies such as speech, camera, video, and audio. I collaborated closely with multimedia SW/HW teams on DSP interface design and conducted high-level design reviews. Additionally, I established and implemented DSP development guidelines to uphold code quality and efficiency within the team.