Taryn Jane D. Email & Phone Number

Bethesda, Md, Us

-Lead a multidisciplinary engineering team supporting research, development, and production-Soft skills: team building, change management, cross-functional collaboration, crucial conversations, tenacity-Streamlined operation and expanded hardware analysis from 330K to $9M+ annually-Increased capacity to support seven work sites, additional business areas, & corporate projects-Developed engineering talent and instructed personnel in failure and physical analysis techniques-Review technical reports & presentations to drive corrective action and cost avoidance-Redesigned workspace with $8M of analytical equipment (including three Corporate Firsts)

Bethesda, Md, Us

-Oversaw Failure Analysis Lab daily operations & ensured timely response to customer deadlines-Mentored junior staff, increasing team size from one to six members-Developed and executed capital roadmap to expand support for additional hardware types-Principal Investigator leading team research in printed wiring board technology & microvias-Analyzed physical defects across hardware types including electro-mechanical assemblies, optics, composites, semiconductors, thin films, and other materials-Provided subject matter expertise to internal and external customers and suppliers-Recommended manufacturing process improvements for design for manufacturability

Pro-bono research advisor for Lyme disease policy development serving New York State Senator, Sue Serino

Armonk, New York, Ny, Us

-Physical and electrical analysis of flip-chip microelectronic packages and 300 mm wafer defects to determine failure root cause and defect identification-Provided subject matter expertise for scanning electron microscopy/microanalysis (SEM), energy-dispersive X-ray spectroscopy (EDS)-Characterized materials for enhanced microelectronic packaging material roadmaps-Recommended corrective actions and product design improvements-Performed competitive analysis for microelectronic package designs

Armonk, New York, Ny, Us

-Managed materials characterization labs supporting thermal and mechanical design teams-Chaired materials department meeting and organized annual planning budget ($20M)-Devised materials DOEs to develop enhanced reliability and failure models-Characterized and selected new materials to achieve enhanced materials roadmaps for thermal interface materials, underfills, seal bands, heat spreaders, and printed circuit boards-Designed and improved thermal-mechanical material characterization standards-Examined the effects of POR material lot variability, materials compatibility, electrical data, and manufacturing processes on product performance and reliabilityAwards & Achievements• IBM Eminence and Excellence Award (2012) • New Hire Network Chair 2011-2013 (400+ persons)

Armonk, New York, Ny, Us

• Mechanical and thermal characterization of thermal interface materials• Future Blue Steering Committee Chair 2008

Charlotte, North Carolina, Us

• Analyzed production failures and compiled corrective action reports• Analyzed new materials and assessed new suppliers• Honeywell Innovation Program (Patent disclosure)

Bachelor'S Degree, Materials Science And Engineering, Mathematics, Nanoscale Materials Science And Engineering

Lehigh Microscopy School (2015), Scanning Electron Microscopy And X-Ray Microanalysis