Teddy Chen Email and Phone Number

Job Role and Activities.1. Manufacturing: SMT, PCBA, Assy, Test and Package of Video Conference Product through NPI to production phase with familiarity of PPAP. APQP, Lean production technique and process.2. Develop, drive production line layout optimization to streamline production by efficiency index.3. Improve line efficiency by streamlining production flow, developing fixtures and jigs to optimize manufacturing processes, to continuously enhance OEE index.

Project Management by Information Technology. Important projects include:1. Employee Management System by using IoT Technology.2. Energy Saving in Office Building with HMI.3. Factory Automation with Robot, semi-product transition platform, and digital management software.

Job Role and Activities.1. To develop Server/Desktop Computer Chassis Tooling and Pars for NPI and sustaining products. Product technique covers Plastic Injection, Stamping, painting, component assembly, etc. 2. To work with OEM Customers (Dell, HP, Lenovo, Acer) to assure Continuous Of Supply, on time Delivery for production parts, and TTM for NPI Projects.3. Supply Chain Management, Component Suppliers evaluation, and readiness check from NPI to production.

Job Role and Activities.1. Develop Mechanical Parts with OEM customer(Quanta, Primax, etc) for Apple iMac Chassis and accessories, including Keyboard, Touchpad, and Mechanical Parts. Process covers, Tooling, Plastic Injection, CNC, Stamping, Anodizing, Sand Blasting, sub assembly.2. Lead Teams(>30 persons) to accomplish supply chain management of mechanical parts to ensure material supply and delivery to Customer factory. Job scope covers supplier evaluation, material control, production management, delivery management.3. Significant Achievements.As process engineering role of task force to launch ChengDu(Capital of South-West China) New Ops Site, we set up large scale facilities to bring iMac Enclosure up and running in 6 months. Machines(>1K sets) and labors(>10K) were built up from totally empty facility for 20+ floors each in area 168mx60m. Now it is the main production site of iMac.

Job Role and Activities.1. Enclosure Sub assembly(Plastics and Metal) business for OEM/ODM/JDM Customers, including Samsung Mobile and China Local brand. Products were applied on Mobile Phone, Wireless Communication Access Device, etc. Process covers Plastic Injection, Stamping, Die-casting, Painting, (PVD)Physical Vapor Deposition, and parts assembly.2. During NPI phase, driving TTM by Stage-Gate methodology, and ramping up for mass transfer.3. To Lead a flat organization which consist of BPM, EPM, Supply Chain, Procurement to fast satisfy customer demand on Information, delivery and material management. We build cost models to evaluate cost, efficiency and improve performance to excel customer requirement. 4. Significant Achievements.4.1 Fast tooling development within 240Hrs for one set of plastics tooling for Mobile Phone(4 big parts and 4 small parts as standard).4.2 To develop product technique including PVD, wire drawing over metal surface, double-injection tooling, to enlarge process capability.

Job Role and Activities.1. To join BU's task force to run a new acquired Flexible PCB and assembly facility from the first beginning.2. To build Company's NPI process and chair the PDT.3. To work with WW tier 1 customers(Dell, Apple, Nokia, Moto, Compaq, etc.), following up their factory audit and PPAP process to bring up new products which were widely applied on NB, Mobile Phone, hand held devices in large quantity.4. Developing the process quality and manufacturing plan through process analysis and critical parameters control.5. Communicating Overseas colleagues(USA, Japan, Europe, China) to execute DFM process and development schedule.6. Significant Achievements.6.1 To assist Company getting not only big jump but also amazing achievement. Revenue increases 150 times to 500MnUSD during 1998~2007. Products are applied on devices of major customer. For example, "Razor" of Motorola.6.2 Developing Flexible PCB product process: 4~6 layers, Rigid-Flex, Single+Single, impedance control(LVDS 50Ohm +/- 5%), Fine Pitch process(3/3 mil), Hinge Flexible PCB with 10K fatigue life. 6.3 New Introduction Equipment. CAM, AOI, Exposure(Orbotech), Etching Line(Camellia), Single Panel Lamination, SMT Automation(Panasonic), etc.6.4 To run Tier 1 customers(Apple, Compaq, Nokia, SEMC, Samsung) and create very good growth rate(CAGR >20% in 8 years).

Job Role and Activities.1. As PDT(Product Development Team) leader, coordinating team members to develop "Board to board Connector" in Connector Division.2. Daily Jobs include Product application in Market, Specification analysis, 3D/2D product drawing, CAE/CAD(ABAQUS, Mold Flow), DFMEA report, Tooling and Components evaluation and approval by 6-Sigma methodology(Cpk), package design, design verification through sample mock-up, mass production transfer, product development scheduling and reports, and product life management.3. Located at Customer production lines, for example Quanta and Compal, to verify product performance by test run.4. Significant Achievements.4.1 To start Company's fine pitch board to board connectors family till now(2020). 4.2 To develop product technique including AntiFlux, EMI Shielding, Pick Place Feature, and file 6 patents in Taiwan, US, and China.