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Electrical/computer Engineer with over 10 years of experience in design, system integration, testing and troubleshooting of embedded systems. Proven ability to rapidly analyze and resolve technical issues. Skilled in working with cross-functional teams to meet goals and complete projects on time. Quick learner who readily embraces new challenges and adapts to changing demands.Programming Languages: C, AssemblyOperating systems: Bare metal, RTOS, µCOS, Embedded Linux (beginner) Processors: Quad core cortex A9, TI MSP430, TI CC2541, Atmel AT90CAN and ATMEGA series, Motorola 68HCS12 Debugging tools: JTAG debuggers, protocol analyzers for I2C, SPI, BLE, Oscilloscopes, logic analyzers Peripherals / Interfaces /Memories: BLE, SDIO, I2C, I2S, HDMI, LVDS, SPI, ADCs, DDR3, SPI flash, SRAM, NOR, NAND, CAN bus, RS232, RS485Sensors & Actuators: Absolute & Incremental Encoders, Infra-red sensors, ultrasonic distance sensors, DC brushless motors, servo actuators for UAVs, accelerometers, camera sensorsVersion control: SVN, GitIssue tracking : JIRA
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Software Development ManagerNextracker, Inc Sep 2015 - PresentFremont, Ca, Us -
Senior Embedded Firmware EngineerLeapfrog Sep 2011 - PresentEmeryville, California, UsChip bring up, hardware platform bring up -
Digital EngineerDowkey Microwave Corporation Aug 2007 - Apr 2009Ventura, California, Us Created schematics in mentor graphics for controller boards of RF matrices. Defined CAN bus and RS232 protocols for communication between various subsystems and components of RF matrices. Developed new firmware for controller boards of RF matrices. Firmware included CAN bus and RS232 communication, command interpretation, command execution, and I/O control. Maintained, debugged, and added new features to existing firmware. Resolved hardware / software issues during system integration. Performed prototype bring up and debugging. Designed hardware connection details to connect computer modules, touch screens, displays, matrix controller boards, and RF switch modules for RF switch matrices. Created software and hardware requirements for outsourced designs and worked closely with consultants to ensure proper functionality. Resolved technical issues reported by customers. Trained a team of 4 technicians to operate and debug various RF matrices, resulting in less engineering involvement in production tests and fixing RMAs. Worked with QA team to obtain UL and CE certification for RF matrices. Conducted extensive tests on a 4x4 RF matrix to prepare for LXI certification. Created detailed documentation, such as user manuals, hardware and software test procedures, wiring diagrams, and installation procedures for each new RF matrix designed. -
Application EngineerTexas Instruments Inc May 2006 - May 2007Dallas, Tx, Us Supervised and analyzed AVV test results for new silicon to identify shortcomings in ATE testing. Silicon bring-up on design validation boards. Supported FAEs to resolved issues on customer end. Customer support for UTOPIA, timer and interrupt modules for TMS320C64x series. Created datasheets, user guides and application notes -
Research AssistantOakland University Jan 2005 - Jan 2006Rochester, Michigan, UsOptimal Energy Delivery Controller for Resistance Spot Welding at Daimler-ChryslerDesigned hardware for Motorola's HCS12 microcontroller based digital controller, to automate the Resistance Spot Welding process for automotive manufacturing. Developed software for 16 bit microcontroller HCS12 using both assembly and C language. -
Project EngineerBadawe Engineers Pvt Ltd Jun 2000 - Dec 2003Designed microcontroller and DSP based motion controllers using DC brushless motors. * Designed DSP related firmware and hardware for embedded servo systems.* Integrated and tested hardware and software modules.* Developed test plans, conducted extensive Functional, Environmental, Dynamic andEMI/EMC tests for quality assurance and generated detailed reports and summaries todocument test results and diagnostic efforts.* Involved in all stages of product development cycle, from specification toinstallation.* Worked on several different electromechanical systems for airborne radars, militaryvehicles, UAV (Unmanned aerial vehicle) etc.
Tejaswini Badawe Skills
Tejaswini Badawe Education Details
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Oakland UniversityElectrical Engineering -
Savitribai Phule Pune UniversityElectrical Engineering
Frequently Asked Questions about Tejaswini Badawe
What company does Tejaswini Badawe work for?
Tejaswini Badawe works for Nextracker, Inc
What is Tejaswini Badawe's role at the current company?
Tejaswini Badawe's current role is Embedded firmware engineer.
What is Tejaswini Badawe's email address?
Tejaswini Badawe's email address is tb****@****ail.com
What is Tejaswini Badawe's direct phone number?
Tejaswini Badawe's direct phone number is +151027*****
What schools did Tejaswini Badawe attend?
Tejaswini Badawe attended Oakland University, Savitribai Phule Pune University.
What skills is Tejaswini Badawe known for?
Tejaswini Badawe has skills like Embedded Systems, Firmware, Debugging, Microcontrollers, Testing, Electronics, C, I2c, Spi, Rtos, Product Development, Sensors.
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