Terry Caskey Email & Phone Number

San Diego

Currently leading consumables product development for Illumina's Next Generation sequencing systems. Focusing on Innovation, Product Quality, and building a world class team of multi-disciplinary product development engineers. Integration and product innovation is my passion. Working at the nexus of micro-fluidics, chemistry, microelectronics, and genomics provides an unprecedented opportunity for unique products and technologies and Illumina is leading the way in leveraging these technologies to unlock the power of the genome.

San Jose, Ca

Built a World Class technology platform and IP portfolio to enable emerging 3DIC technologies for microelectronics packaging. Responsibilities include technology roadmap definition, market research, benchmarking, IP landscaping and acquisition, and oversight of all R&D activities.A paradigm shift in the semiconductor industry is seeing an integration of the Front End Fab design with the Far Back End packaging design in an unprecedented way. 3DIC is the technology at the heart of this paradigm shift with the promise of reduced power consumption, increased bandwidth performance, and minimized form factor.

Led a multi-disciplinary team responsible for the definition and implementation of a commercially viable packaging technology to support Pac Bio's Optical MEMS-based DNA sequencing technology.Product redesign for manufacturability including a wafer-scale packaging scheme.Vendor selection and management including contract manufacturing at multiple sites.Developed and maintained Should-Cost production models.Ramped the packaging line from concept to beta product release in less than 12months.Successfully utilized Design for Manufacturability (DFM) and Total Quality Management to enable a smooth transfer to production for Pac Bio's lead products.

Utilized Management by Objectives to effectively lead staff of 8 engineers.Re-Engineered VCI's patented DRAM interconnect technology for low cost, high volume manufacturability and enabled technology transfer to VCI's first licensee in Asia.Ramped flagship 8hi Flash Memory product from concept to pilot production in 6 months.Defined VCI's Package Technology Roadmap for 2008-2009.

Flash Memory GroupTechnical project manager responsible for development and ramp to production of cutting edge 1.4mm sCSP's (stacked chip scale packages) with mixed Flash/RAM memory.Managed product development and production activities at third party subcontractors through Intel's engineering teams in the US, China, and Korea.Chaired Intel's Technical Product Risk Assessment Team responsible for ratifying SiP and MCM products based on current technological and manufacturing capabilities.

MaterialsUtilized expertise in polymer materials and characterization to develop new composite materials capable of supporting Low-K Dielectrics in Intel's Pentium (CPU) product line.Managed the implementation of new Wafer Saw materials for Intel's Core Duo product line. Received Intel Divisional Recognition Award for enabling $5M cost reduction.

Fabricated novel nano-composite materials using Supercritical CO2 as a processing medium to drive densification of intercalated montmorillonite structures.Utilized principles of Fracture Mechanics to map structure-property relationships in composite materials having long range order from the molecular scale to the micro-scale.

Developed and characterized materials for microelectronics packaging applications in satellite guidance systems.

Phd, Polymer Science And Engineering

Bs, Chemistry

Diploma