Thomas Kormann Email & Phone Number

Bernin

Product Industrialization and Process Integration.Business Unit Communication & Power.SOI technology for Radio Frequency applications.

Singapour

I followed my wife expatriation in Singapore.I took the opportunity to take care of my elder son and my two newborns twins daughters.Great experience to be "daddy at home" and spent so much time with your own kids.

Crolles (France)

Thesis research embeded in the Crolles 2 Alliance, a 300mm wafer fab R&D and pilot line shared between NXP semiconductors, Freescale semiconductors and STmicroelectronics:- Surface preparation before epitaxy and deposit of monocrystalline Si and Si1-xGex for advanced CMOS technologies, node 65 nm and beyond.- HF-last wet clean characterization and optimization, either on wet bench and single wafer.- Thermal budget reduction of the H2 pre-epitaxial bake.- Si and SiGe epitaxy applicated to e-SiGe, FDSOI, TOSI, DG, SON and other technologies. - Implementation of the metrology associated to the SiGe material, new in the pilot line.

Lamip (Laboratoire De Microélectronique Ensicaen-Philips), Caen (France)

Post-modification of an integrated circuit design with a Focused Ion Beam :Building contacts on doped polysilicium to decrease the resistance value.Study (characterizations and TEM) of the platinum-polysilicium contact made in the FIB.

Msc (Material Science Centre), Manchester (England)

Highlighting (SEM, EDX, WDS…) of atomic migrations responsible for “ageing” effects in Nickel-Manganese Oxide NTC thermistors.

French School For Engineer (Master'S Degree), Materials Option

Doctor Of Philosophy (Phd), Dense Media, Materials And Components

Oral defence 04/03/2011

Dea (Master Equivalent), Materials Science

Education record

Education record